Hiring.Camp
This job is no longer accepting applications. Similar open roles are listed below.

Advanced Packaging Process Development Engineer - Principal

SkyWater Technology Foundry, Inc.

·

Jun 3, 2026

Location
200 NeoCity Wy, Kissimmee, FL 34744, USA
Source
Dayforce

Similar Jobs

30

Director of Advanced Packaging Process Engineering

SkyWater Technology Foundry, Inc.·200 NeoCity Wy, Kissimmee

2mo ago

Advanced Packaging Process Support Engineer

Applied Materials·Hwaseong-si, KR·Remote, Onsite

3mo ago

Advanced Packaging Process Support Engineer

Applied Materials·Hwaseong-si, KR·Remote, Onsite

3mo ago

Advanced Packaging Process Support Engineer

Amat·Hwaseong-Lucestar, KOR·Remote, Onsite

3mo ago

Advanced Packaging Process Support Engineer

Amat·Hwaseong-Lucestar, KOR·Remote, Onsite

3mo ago

Advanced Packaging Process Engineer III E3)

Applied Materials·Santa Clara, CA

3mo ago

Advanced Packaging – Process Technician

General·Sunnyvale, CA

5mo ago

Advanced Packaging Process Integration Engineer

Global Foundries·USA - Vermont - Essex Junction, US

5mo ago

Shift Process Engineer, Advanced Packaging Technology Development (APTD)

Micron Technology·Boise, ID

3w ago

Shift Process Engineer, Advanced Packaging Technology Development (APTD)

Micron·Boise, ID - Main Site

3w ago

Principal Wet Process Engineer, Advanced Packaging

Micron Technology·Boise, ID

1mo ago

Principal Wet Process Engineer, Advanced Packaging

Micron·Boise, ID - Main Site

1mo ago

Senior Advanced Packaging/MEMS Process Engineer

Draper·FL - St. Petersburg - Advanced Packaging Facility, US·Onsite

1mo ago

Shift Process Engineer, Advanced Packaging Technology Development (APTD)

Micron Technology·Boise, ID

1mo ago

Process Engineer - Advanced Packaging

Applied Materials·Santa Clara, CA

3mo ago

Process Engineer - Advanced Packaging

Amat·Santa Clara, CA

3mo ago

Process Technician, Advanced Packaging

Micron Technology·Boise, ID

4mo ago

Process Technician, Advanced Packaging

Micron·Boise, ID - Main Site

4mo ago

Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)

Micron·Boise, ID - Main Site·Hybrid

1d ago

DMTS Process Development Engineer, Advanced Packaging

Micron·Boise, ID - Main Site·Hybrid

4d ago

DMTS Process Development Engineer, Advanced Packaging

Micron Technology·Boise, ID·Hybrid

4d ago

MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

Global Foundries·SGP - Woodlands, Singapore

3w ago

Director, Process Support Engineer (Advanced Packaging)

Applied Materials·SG

3mo ago

Director, Process Support Engineer (Advanced Packaging)

Amat·Singapore, SGP

3mo ago

Technology Development Process Engineer (Hybrid Bonding & Advanced Packaging)

Amat·Singapore, SGP·Remote, Hybrid

1w ago

Technology Development Process Engineer (Hybrid Bonding & Advanced Packaging)

Applied Materials·SG·Hybrid

1w ago

Advanced Packaging Inspection (Mantis-D) Process Support Engineer

Amat·Hwaseong-Lucestar, KOR·Remote, Hybrid, Onsite

1mo ago

Advanced Packaging Inspection (Mantis-D) Process Support Engineer

Applied Materials·Hwaseong-si, KR·Hybrid

1mo ago

Sr Advanced Packaging Technology Development Engineer, Bonding process

Micron·Taichung - Fab 16, Taiwan·Hybrid, Onsite

4w ago

Sr Advanced Packaging Technology Development Engineer, FILM process

Micron·Taichung - Fab 16, Taiwan·Onsite

4w ago