Principal Design Engineer - Sustaining, HBM

Req ID:

JR101726 Principal Design Engineer - Sustaining, HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability!

As a Principal HBM Design Engineer – Sustaining, you will lead cross-functional efforts to drive silicon debug, product quality, and system-level stability for high-volume HBM products. You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms.

You will operate at the intersection of design, silicon, and system behavior, providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations.

## Responsibilities

• Silicon & System Debug: Lead root-cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple domains.
• Technical Leadership: Define debug strategies, guide cross-functional teams, and serve as a technical authority in HBM sustaining efforts.
• Cross-Functional Execution: Drive alignment and execution across DE, PE, TD, and system teams to ensure efficient issue resolution and product delivery.
• Design Ownership: Own design health in sustaining phase, driving ECO implementation, verification, and long-term maintainability.
• Quality & Yield Leadership: Identify systemic issues and lead initiatives to improve yield, reliability, and performance across HBM products.
• Customer Impact: Lead critical customer escalations and system bring-up support, ensuring timely resolution and high customer satisfaction.
• Forward Influence: Drive feedback into architecture, design, and verification methodologies to improve future HBM product quality and robustness.

## Qualifications

• 8+ years (BS) or 6+ years (MS) in Electrical/Computer Engineering or related field
• Deep expertise in HBM/DRAM architecture and high-speed memory interfaces
• Strong experience in silicon debug, system-level analysis, and root-cause resolution
• Proven ability to lead complex technical problems across cross-functional teams
• Strong background in digital and/or custom design and verification

## Preferred Qualifications

• Demonstrated ownership of complex silicon/system issues impacting product or customer delivery
• Experience influencing architecture, design trade-offs, or product decisions
• Deep understanding of: Timing, margining, SI/PI, System-level behavior and silicon correlation
• Experience with DFT, mBIST, and test-mode debug
• Strong scripting/automation skills (Python)
• Excellent communication skills with ability to drive alignment at senior technical levels

Job Profile(s):

Systems Design Engineer 5

Relocation Level: TBD

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