Sr BEOL Engineer - DRAM Process Integration

Req ID:

JR115927 Sr BEOL Engineer - DRAM Process Integration

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Join Micron as a Sr BEOL Engineer - DRAM Process Integration and take part in a motivated team pushing the boundaries of semiconductor technology. This role provides a remarkable opportunity to work on pioneering research and development, playing a key role in innovative progress in memory and storage solutions!

As a Sr BEOL Engineer, you will take on a vital role in our back-end-of-line (BEOL) process-integration group within Research and Development. You will partner with skilled specialists to create, refine, and deliver semiconductor process-integration flows. Your knowledge will support maintaining the high standards and competitiveness of our processes.

## Responsibilities

• Support the development, optimization, and integration of semiconductor process flows.
• Help resolve integration problems across process modules, including metallization, dielectrics, etch, and chemical-mechanical planarization.
• Collect, analyze, and interpret process and electrical data, employing AI-enabled modeling and analytical tools to identify patterns and anomalies and support yield and reliability improvements.
• Collaborate with module engineering, device engineering, reliability, and manufacturing teams to resolve technical challenges.
• Participate in process-transfer and production-readiness activities.
• Document technical findings and present results and recommendations to engineering teams and leadership.
• Learn and implement statistical analysis methods and software such as JMP, Python, R, or similar tools.
• Support semiconductor process-integration research and technology-development activities.

## Minimum Qualifications

• Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or a related area with at least two (2) years of proven experience. A PhD or equivalent experience in these subjects also qualifies if supported by relevant coursework or research related to thin films, interconnect technology, nanofabrication, or similar topics.
• Basic knowledge of semiconductor manufacturing techniques (thin film deposition, etch, lithography, CMP)
• Familiarity with BEOL concepts: metallization, interconnects, dielectrics, barrier/liner films.
• Hands-on experience with one or more thin-film deposition or etch processes, such as chemical vapor deposition, atomic layer deposition, or physical vapor deposition.
• Experience with semiconductor device technologies and with at least one of the following: process integration, yield improvement, or reliability testing.

## Preferred Qualifications

• Internship, cooperative-education, research, or work experience in a semiconductor fabrication or R&D environment.
• Ability to learn new technical concepts, adapt to changing project requirements, and prioritize multiple tasks.
• Experience with statistical-analysis tools such as JMP, Python, R, or equivalent software.
• Experience using or learning AI-enabled tools to support engineering data analysis, technical research, workflow automation, or problem-solving.
• Familiarity with characterization techniques such as scanning electron microscopy, transmission electron microscopy, X-ray diffraction, or electrical testing.
• Experience with design-of-experiments methodology.
• Knowledge of semiconductor reliability principles such as electromigration, time-dependent dielectric breakdown, or stress migration.

Job Profile(s):

Semiconductor Process Engineer 3 - Process Development Engineer - PhD

Relocation Level: TBD

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