BSP SW Customer Engineer

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Company:

Qualcomm China

## Job Area:

Engineering Group, Engineering Group > Software Applications Engineering

General Summary:

Company Overview

Qualcomm Technologies, Inc. is a world leader in wireless technology innovation and the driving force behind the development, launch, and expansion of 5G. Our Industrial Connectivity Business Unit delivers cutting-edge connectivity solutions — including Wi-Fi 6/6E/7, Bluetooth 5.x, Thread/Matter, Zigbee, and 5G/LTE — purpose-built for industrial IoT, smart manufacturing, robotics, and Industry 4.0 applications. The Xi’an R&D and application engineering team plays a strategic role in supporting Qualcomm’s growing industrial customer base across China and the broader APAC region.

Position Summary

We are seeking a highly motivated Senior Application Engineer based in Xi’an to join our Industrial Connectivity Business Unit. You will serve as the primary technical interface between Qualcomm and our industrial customers, ODM/OEM partners, and ecosystem collaborators in China. The core focus of this role is RTOS BSP (Board Support Package) development and enablement — you will own the bring-up, porting, and optimization of Qualcomm connectivity chipset BSPs on customer hardware platforms running RTOS environments.

Experience with Qualcomm MDM (Mobile Data Modem) platforms is a strong plus. You will drive successful adoption across the full product lifecycle: from pre-sales technical engagement and BSP design-in support through to production optimization and field issue resolution. Strong English communication skills are essential, as you will collaborate daily with global engineering, product, and business teams.

Key Responsibilities

• Customer Technical Engagement: Serve as the primary technical point of contact for industrial customers and ODM/OEM partners in China; understand customer hardware platforms, RTOS environments, and connectivity requirements to propose and enable optimal Qualcomm BSP solutions.
• RTOS BSP Bring-Up & Porting: Lead end-to-end BSP bring-up of Qualcomm connectivity chipsets on customer target boards; port and adapt BSP components — bootloader, clock/power management, GPIO, UART/SPI/I2C/USB peripheral drivers, interrupt controllers, and memory maps — to customer-specific hardware under FreeRTOS, ThreadX, Zephyr, or equivalent RTOS.
• Board Bring-Up & Hardware Validation: Collaborate with customers on hardware schematic review, PCB layout guidance, and signal-integrity analysis; execute board bring-up procedures, validate BSP functionality against hardware specifications, and document bring-up checklists and test results.
• Qualcomm MDM Platform Support: Support customers adopting Qualcomm MDM-series platforms (QIM series) for industrial LTE/5G connectivity; guide BSP-level integration of MDM firmware, AT command interfaces, data call management, and FOTA/SOTA update mechanisms.
• Technical Issue Resolution: Investigate and resolve complex customer-reported BSP and firmware issues — including boot failures, driver crashes, RTOS scheduling anomalies, and wireless stack integration defects; use JTAG/SWD debuggers, logic analyzers, QXDM, and oscilloscopes to isolate root causes; collaborate with Qualcomm global R&D to drive fixes.
• Cross-Functional & Global Collaboration: Work closely with global Product Management, R&D, and Sales teams — primarily in English — to relay customer BSP feedback, influence chipset and SDK roadmaps, and develop reference BSP packages, application notes, and integration guides.
• Documentation & Knowledge Sharing: Author BSP porting guides, bring-up checklists, driver API references, and troubleshooting FAQs in English; maintain internal knowledge bases and contribute to customer-facing developer portals.

Minimum Qualifications

• Bachelor’s degree or above in Electrical Engineering, Computer Engineering, Computer Science, Embedded Systems, or a related technical field.
• 5+ years of experience in embedded systems engineering, BSP development, or firmware engineering roles; at least 3 years focused on RTOS BSP work.
• Deep hands-on expertise in RTOS BSP development with at least one mainstream RTOS (FreeRTOS, ThreadX / Azure RTOS, Zephyr, VxWorks, or equivalent): bootloader porting, clock tree / power domain configuration, peripheral driver development (UART, SPI, I2C, USB, GPIO, DMA, interrupt controller), and RTOS task/scheduler tuning.
• Proven experience in board bring-up: reading schematics and datasheets, configuring pin-mux and memory maps, validating hardware with JTAG/SWD debuggers, logic analyzers, and oscilloscopes.
• Proficiency in C programming for bare-metal and RTOS environments; solid understanding of ARM Cortex-M/A architecture, linker scripts, and memory-mapped I/O.
• Familiarity with wireless connectivity integration at the BSP/driver level: Wi-Fi (802.11), Bluetooth, and/or cellular (LTE/5G) host-driver porting onto RTOS.
• Strong debugging skills: crash dump analysis, stack trace interpretation, real-time trace (ETM/ITM), and use of QXDM or equivalent diagnostic tools.
• Business-level English proficiency — both written and spoken — is mandatory; must be able to write technical documents, emails, and reports in English and participate in English-language meetings with global teams.

Preferred Qualifications (Nice to Have)

• Qualcomm MDM Platform BSP Experience — Hands-on BSP bring-up or driver development on Qualcomm MDM-series platforms (MDM9205, MDM9607, MDM9x40/45, SDX55/62/65); familiarity with Qualcomm AMSS/MPSS firmware architecture, QuRT RTOS, Qualcomm-specific diagnostic tools (QXDM, QPST, QFIL), AT command customization, data call management, and FOTA/SOTA update mechanisms.
• Secure Boot & OTA — Experience implementing secure boot chains (chain-of-trust, image signing, TrustZone / TEE integration) and OTA/FOTA update frameworks on RTOS platforms.
• Power Management BSP — Expertise in RTOS power management BSP: sleep/wake state machines, clock gating, voltage scaling, and wakeup source configuration for ultra-low-power industrial IoT devices.
• Industry Background — Experience in industrial automation, robotics, smart manufacturing, energy management, or related Industry 4.0 domains where RTOS-based connectivity solutions are deployed.

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Applications Engineering, Software Development experience, or related work experience.

OR

Master's degree in Engineering, Information Systems, Computer Science, or related field and 1+ year of Software Applications Engineering, Software Development experience, or related work experience.

OR

PhD in Engineering, Information Systems, Computer Science, or related field.

• 1+ year of any combination of academic and/or work experience with Programming Language such as C, C++, Java, Python, etc.
• 1+ year of any combination of academic and/or work experience with debugging techniques.

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