- Location
- Tianjin (Xinghua), China
- Type
- Full-time
- Department
- Engineering
- Education
- PhD
- Source
- Workday
Description
Job Description:
- Understand the semiconductor market and translate market requirements to packaging effectively. Responsible for the design, development, execution, and implementation of packaging product, structures, or assembly process technologies. Address and solve materials and processing issues that may occur during the development process.
- Develop solutions by working closely with Package Innovation teams including Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing.
- Familiar with project management by using industry standard project management tools.
- Collaborate with NXP internal assembly sites and OSATs to qualify product package solutions.
- Investigate the feasibility of emerging technologies and capabilities to potential semiconductor packaging and assembly process. Then, effectively develop or design the implementation of these into manufacturing.
- Maintain substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences. May also participate in development of patent applications.
- May involve international travel to package assembly sites and NXP suppliers.
Qualifications:
- M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering
- Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
- Knowledge of various IC packages like QFP, QFN, BGA, FCBGA, FCCSP, WLCSP and FOWLP is a plus.Knowledge of Statistical Analysis and Design of Experiment is a plus.
- Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
Skills
Project Management
