Package Manufacturing Engineer, Senior to Staff Level (Kaohsiung or Taichung)

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Company:

Qualcomm Semiconductor Limited

## Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

Overview

• Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment

• Support development of products and advanced technologies for Qualcomm bumping, WLP, Flip Chip CSP& BGA , SiP module, EMIB, CoWoS, CPO, Data center, ASIC, SIP, Server, Rack, and 2.5/3D Chiplet applications

• Support product material and design selections, technical risk assessments, mitigation plans, and development from concept to production

• Candidate will develop a strong understanding of substrate and assembly process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs

• Candidate will work cross-functionally with Design, Device process development, internal and subcontract Packaging groups

Minimum Qualifications

• 10+ years of relevant work experience in Semiconductor (Packaging) Engineering or Manufacturing

• Deep understanding of packaging requirements, process capability and equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process included automotive products requirements

• Familiar with excel, JMP data analysis tool

• Basic knowledge of excel VBA, Tableau software

• Good understanding of Chip level and package level reliability and failure analysis methodology

• Understand yield management, continuous improvement, assembly cycle time analysis and cost reduction

• Fluent in English and Mandarin, both spoken and written

• Proactive working attitude and capable to handle new challenge

Preferred Qualifications

• Good knowledge of quality concept and RMA process

• Basic knowledge of foundry process

• Good understanding of wafer bumping, laser grooving, wafer saw, Pick and place, underfill and Heat spread processes

• Good experience with yield management software (O+), JMP analysis tool

• Understand assembly and test house working model, turnkey model, supply chain and KPI

Education Requirements

Preferred Master's degree in Electrical Engineering, Physics, Materials Science, or related discipline; Good Bachelor candidate with wide spectrum may be considered as well.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

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