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MTB PWF DEBOND Equipment Engineer

Micron Technology

·

Oct 29, 2024

Location
Taichung City,TW, TW
Type
Full-time
Department
Engineering
Education
Bachelor
Source
Eightfold

Description

Installation, accountable and sustain for Debond equipment.​ Backup for Bond area equipment basic maintenance.​ Establish and improve process condition and technology.​ Upgrade tool capability and improve product quality.​ Establish and modify process management projects.​ Set up process parameters for a variety of semiconductor equipment.​ Evaluation, promotion and planning of new equipment / materials.​ Abnormal analysis and improvement.​ Preferred to have over 3-year of working experiences in production line.​ Bachelor degree or above.

Skills

Go.NETSalesforceWorkday

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