- Location
- Santa Clara, CA, USA · California, USA
- Workplace
- Remote, Hybrid
- Department
- Product
- Education
- PhD
- Source
- Greenhouse
Description
About the Role
At NcodiN, we are redefining the future of AI computing. Our breakthrough optical interposer enables the next generation of AI system to scale beyond the copper wall. With the world’s smallest laser integrated on silicon, we eliminate traditional driver and modulator overhead and redefine system power and area efficiency. Joining NcodiN today means becoming part of a bold, fast-growing company backed by industry leaders.
We are seeking highly motivated and technically strong Analog/Mixed-Signal IC Design Engineers to join our high-speed optical transceiver development team. The position title and level will be determined based on the candidate's experience and qualifications. You will work closely with photonics, systems, packaging, and product engineering groups to architect, design, and productize cutting‑edge electro‑optical interconnects that enable Ncodin’s optical I/O platform.
This role is ideal for an engineer who thrives in fast‑moving startup environments, enjoys owning architecture‑to‑silicon execution, and wants to help build transformative optical interconnect technology.
Work sites
Santa Clara, CA, or Portland, OR. Hybrid or fully remote position will be considered
Responsibilities
- Design, simulate, and model high‑speed analog/mixed‑signal circuits for optical transceiver front‑ends (TIA, CTLE, drivers, PLLs, PVT sensors, DAC/ADC, and bias circuits) in advanced CMOS or SiGe BiCMOS processes targeting multi‑tens‑of‑GHz bandwidth and ultra‑low‑power operation.
- Collaborate with photonics engineers to derive system‑level and block‑level specifications for electrical ICs supporting high‑speed electro-optical links.
- Work with system architects to partition functions between analog, digital, and photonic domains.
- Perform IC floor-planning, layout guidance, and parasitic modeling for high‑speed signal paths.
- Model package parasitics and co‑optimize electrical/optical performance for co‑packaged optics (CPO) or integrated optical engines.
- Evaluate, characterize, and debug electrical and optical building blocks in lab environments using high‑speed measurement equipment.
- Support development of automated test setups for device and system‑level validations.
- Work with manufacturing and product engineering teams on production test, qualification, and reliability validation of EIC/PIC components.
Qualifications
- S. or Ph.D. in Electrical Engineering with a focus on high-speed analog/mixed-signal ICs, RF ICs, or electro-optical integrated circuits.
- Minimum of 5 years of industry experience for M.S. candidates or 3 years for Ph.D. candidates in the design of analog/mixed-signal, RF, or electro-optical integrated circuits.
- Hands-on experience with industry-standard design and simulation tools, such as Cadence Virtuoso/Spectre, Keysight ADS, Ansys HFSS/Momentum.
- Strong design expertise in at least two of the following areas: laser drivers; TIAs, CTLE, filters, LNAs, and PLL.
- Experience designing circuits for SerDes, UCIe, or optical interconnects with bandwidths exceeding 10 to 30 GHz is highly desirable.
- Solid understanding of NRZ and PAM4 modulation schemes, link-budget analysis, and high-speed signaling concepts.
- Proficiency with high-speed test and measurement equipment, including oscilloscopes, vector network analyzers (VNAs), spectrum analyzers, bit-error-rate testers (BERTs), and optical characterization instruments.
- Experience in characterization and validation of electronic IC (EIC) and photonic IC (PIC) performance for high-speed optical transceivers is a plus.
- Knowledge of advanced packaging technologies for optical engines, co-packaged optics (CPO), and heterogeneous integration is highly desirable.