Principal Engineer Unit Process Development

#WeAreIn for jobs that impact everyone's life. What if your ideas could change the way the world connects, powers up, or thinks? As a Principal Engineer Unit Process Development in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in? Your role Key responsibilities in your new role Responsible for Die Attach and Component Attach

processes across development and manufacturing operations. Collaborate with innovation, package development, and

production teams across Europe and Asia sites to develop and maintain a

long-term Unit Process Roadmap covering processes, equipment, and materials,

enabling faster time-to-market and minimizing development and manufacturing

complexity. Support and govern Platform Unit Process Development

by applying technical expertise and driving alignment within projects to

address critical issues and agreements. Develop and maintain long-term strategies for the

assigned unit processes, ensuring alignment across Backend operations,

identifying gaps, and driving actions and projects to close them. Govern the Process Block Catalog (PBC) and serve as

the technical expert for the Technical Process Chain (TPC), ensuring key unit

processes are clearly defined and strictly aligned with the Process Block

Catalog and Technology, Material, and Equipment Roadmaps. Drive Design-to-Cost initiatives with a focus on key

equipment suppliers, establishing strategic long-term partnerships to achieve a

30% reduction in investment cost per piece for new equipment introduced within

the roadmap. Your profile Qualifications and skills to help you succeed  Degree, Master's Degree, or PhD in Mechanical

Engineering, Materials Engineering, Materials Science, or related disciplines. More than 10 years of experience in the semiconductor

industry. Extensive expertise in unit process development,

particularly in Die Attach processes (adhesive, film, soldering, sintering,

diffusion soldering, preform, printing, etc.) and/or Component Attach processes

(printing, component pick-and-place, reflow, ball attach, surface mount, etc.). Experience working in a multinational organization and

leading teams within a cross-functional environment. Strong knowledge of semiconductor R&D, technology

roadmap development, and technology realization. Good understanding of industry trends and competitor

technologies. Familiarity with assembly subcontractor portfolios and

intellectual property processes. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.  Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.