Hiring.Camp

Senior Engineer, Semi Packaging Engineering

Analogdevices

·

Jun 30, 2026

Salary
$110k – $151k
Location
US, CA, San Jose, Rio Robles, United States of America
Type
Full-time
Department
Engineering
Seniority
Senior
Experience
3+ years
Source
Workday

Description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

          

Position Overview

We seek a highly motivated Senior Packaging Engineer to drive package development and deployment within our New Product Introduction (NPI) pipeline. This role will work closely with Business Units, global operations, and external partners to deliver robust, scalable NPI packaging solutions while enabling supply chain resilience and continuous improvement in our development systems.

Key Responsibilities

  • NPI Package Development
    • Partner with Business Units to define, develop, and release semiconductor packaging solutions as part of the NPI pipeline
    • Drive package design, qualification, and production readiness to meet performance, cost, and schedule requirements
  • Cross-Functional Collaboration
    • Work closely with design, reliability, QA, and operations teams to ensure seamless product introduction
    • Interface with global subcontractor partners, particularly in Asia, to execute development and production plans
  • Supply Chain & Operations Support
    • Support and lead operations-initiated projects focused on supply chain resiliency, cost optimization, and dual-sourcing strategies
    • Identify and mitigate packaging-related risks across the supply base
  • Systems & Process Development
    • Contribute to the architecture and continuous improvement of NPI systems and workflows
    • Help define best practices for package release, change management, and data integrity
  • Data & Analytics
    • Utilize data-driven approaches to improve development cycle time and decision-making
    • Work with assembly master data and leverage insights using data analytics platforms such as KNIME

Required Qualifications

  • Master’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, Applied Physics or related field
  • 3-4 years of experience in a fast-paced microelectronics or semiconductor packaging environment
  • Strong understanding of semiconductor assembly processes and package qualification methodologies
  • Experience working in fast paced cross-functional, global development environments
  • Demonstrated ability to drive projects from concept through production
  • Experience in use of 2D AutoCAD. 3D CAD tools a plus.

Preferred Qualifications

  • Experience in systems integration and/or NPI systems development
  • Familiarity with assembly master data structures and change management processes
  • Familiarity with data analytics tools such as KNIME or RDBMS systems.
  • Experience working with OSATs / subcontractor ecosystems, particularly in Asia
  • Experience with simulation tools like Flotherm and ANSYS, and MS Office tools

Key Skills & Attributes

  • Strong problem-solving and analytical skills
  • Self-starter, ability to operate effectively in a fast-paced environment
  • Excellent communication and stakeholder management skills
  • Results-oriented with a focus on execution, impact and continuous improvement

Why Join Us

This role offers the opportunity to influence both product development and the systems that enable it, working at the intersection of engineering, operations, and strategy in a high-impact environment.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

          

Required Travel: Yes, 10% of the time

          

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $109,940 to $151,168.
  • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

Skills

AutoCADChange Management

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