- Location
- SG
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Source
- Eightfold
Description
This role focuses on ensuring the reliability of new semiconductor package technologies through assessment planning, electrical testing, failure analysis and qualification support. The engineer will identify potential reliability risks, validate performance against customer application requirements, and drive improvements in reliability methods and digitalisation. Your role Key responsibilities in your new role Reliability Strategy & Planning: Define and implement
comprehensive reliability assessment plans for emerging package technologies.
Align strategies with package requirement profiles and failure-mechanism-based
FMEA to validate technical capability against specified reliability requirements,
including rigorous customer mission profile compliance. Test Capability Development: Establish and validate
electrical test infrastructure to support feasibility studies for new
package/product technologies. Lead early-stage reliability assessments
utilizing prototype chips to de-risk product development cycles. Risk Identification & Analysis: Proactively identify novel
failure modes beyond the scope of current industry standards. Apply advanced
statistical analysis to quantify potential risks and inform decision-making. Execution & Evaluation: Direct the execution of
reliability stress tests, integrating electrical and physical analyses within
system-level application contexts. Synthesize data to derive conclusive
reliability assessments and provide strategic recommendations. Cross-Functional Collaboration: Participate in high-level
project discussions regarding package delta analyses and risk mitigation
strategies. Qualification Support: Provide technical
oversight and support for the qualification of new packages, process
introductions, and production changes. Innovation & Digital
Transformation: Lead departmental initiatives focused on digital transformation and the development of next-generation reliability methodologies to enhance operational efficiency and accelerate business outcomes. Your profile Qualifications and skills to help you succeed Education: Bachelor’s or Master’s
degree in Materials Science, Physics, or Electrical & Electronics
Engineering. Experience: 0–5 years of progressive
experience in the semiconductor industry, covering both frontend and backend
manufacturing. Demonstrated expertise in reliability engineering, test program
setup, and product qualification testing is required. Professional Competencies: o Demonstrates strong
autonomous work ethics and proactive leadership in driving continuous
improvement initiatives. o Possesses superior
communication and interpersonal skills, fostering effective cross-functional
teamwork. o Proficient in
problem-solving frameworks, statistical analysis, and Failure Mode and Effects
Analysis (FMEA) methodologies. Preferred Assets: Proven track record in
implementing digitalization solutions or advanced reliability methodologies. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Carol Lee