Hiring.Camp

Chip Integration Design Lead

Broadcom

·

2 days ago

Location
IND-Bangalore Electronic City - S1, India
Type
Full-time
Department
Design
Seniority
Lead
Closing date
Today
Source
Workday

Description

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Job Description:

Design Lead for Chip Integration working closely with other functional teams (block design, DV, IP, PD, uArch, SW, Board Design) to execute complex cutting edge ASIC chips. Evaluates all aspects of the process flow from high-level design to synthesis, place and route, and timing and power use.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

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