- Location
- Wuxi, Jiangsu,CN, CN
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Experience
- 5+ years
- Education
- Master
- Source
- Eightfold
Description
Identify and develop new wire bonding processes for products/packages,establish process controls to ensure high quality and reproducible manufacturing.
Your Role
Key responsibilities in your new role
1.Identify and develop new wire bonding processes for products/packages,establish process controls to ensure high quality and reproducible manufacturing.
2.Perform and guide WB process development: parameter scouting,optimization, verification, and process freeze to meet timeline,quality, cost, and manufacturability targets.
3.Support prototype and development sample builds; conduct technical handshakes and knowledge transfer to production and operation teams.
4.Generate and update process documents: Process Specification,PFMEA/DFMEA, Control Plan, OJTI, Build Sheet, etc.
5.Lead and participate in cross-functional problem-solving teams usingSPC, DOE, 8D, FMEA to resolve yield and quality issues.
6.Develop new WB technologies (e.g., Cu wire, ultra-fine pitch) and improve process capability for new product requirements.
7.Provide technical guidance to junior engineers; contribute IP ideas based on industry research.
8.Liaise with suppliers for continuous improvement; qualify new WBtools, equipment, and materials.
Your Profile
Qualifications and skills to help you succeed
1.Bachelor or Master’s degree in Electrical, Electronics, Materials,Mechanical, Automation, or Semiconductor Engineering.
2.Minimum 5+ years hands-on experience in semiconductor packaging,specializing in wire bonding (Au/Cu wire) process development orhigh-volume manufacturing.
3.Strong knowledge of WB equipment (ASM/K&S/SHINKAWA), processparameters, and failure modes (e.g., stitch crack, wire sweep, bondlift).
4.Proficient in statistical tools: SPC, DOE, Minitab; skilled in rootcause analysis (8D/FMEA).
5.Hands-on lab skills: oscilloscope, bond tester, wire pull/sheartester, optical microscope.
6.Good English communication (written/spoken) for global collaboration.
7.Self-driven, strong analytical skills, team player, and able to driveprojects independently.
Contact:
[email protected], LinkedIn
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