- Location
- Gandhinagar, India
- Department
- IT
- Seniority
- Lead
- Source
- Keka
Description
Job Description :
Core Responsibilities
- Layer Layup & Alignment: Precisely stack inner cores, prepreg, and copper foils using registration pins to ensure perfect alignment.
- Machine Operation: Load and unload heavy steel plates and panels into large industrial bonding presses.
- Parameter Control: Program and monitor precise temperature, pressure, and vacuum profiles to melt and cure the resin without causing warping or air voids.
- Quality Inspection: Inspect bonded panels for defects, delamination, or misregistration using measurement tools and visual checks.
Key Requirements & Skills
- Experience: 1–3 years in electronics manufacturing or printed circuit board fabrication.
- Technical Knowledge: Understanding of PCB stack-ups, material properties, and lamination profiles.
- Dexterity & Detail Orientation: High level of hand-eye coordination and attention to detail for handling fragile copper foils and insulating sheets.
- Physical Stamina: Ability to lift heavy steel press plates and stand for extended periods.