- Location
- Oklahoma City, Oklahoma, United States · published
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Source
- Workable
Description
- Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
- Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
- Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
- Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
- Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
- Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
- Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
- Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
- Mentor team members; uphold engineering rigor and documentation quality
- Other duties as assigned
This position is contingent upon contract award.
Benefits
Health Care Plan (Medical, Dental & Vision)Retirement Plan (401k, IRA)Life Insurance (Basic, Voluntary & AD&D)Paid Time Off (Vacation, Sick & Public Holidays)Short Term & Long Term DisabilityTraining & DevelopmentWellness Resources