Principal Engineer Package Technology

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Package Technology, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in? Your role Key responsibilities in your new role In this role, you will  lead the definition, design, and development of semiconductor packaging solutions  from concept and feasibility studies through to realization, ensuring they meet electrical, thermal, mechanical, reliability, and business requirements. You will serve as the technical expert and consultant for package design and assembly technologies ,  driving innovation, cross-functional collaboration, technology scouting, and knowledge creation through technical publications and patent development. Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realization Be the  driver for technical definition  ( BOM, package design, Assembly technology, review PRP, project classification , etc.) activities for package projects with major changes/new package, risks and impact Generate conceptual package outline and internal construction drawings , finalize and document the drawings and update the package drawings as needed Define  the package characteristic to meet the electrical, thermal, reliability and mechanical requirements Be the contact partner and technical consultant  for package definition to Business Division especially on BE assembly technology know how Support pre development & project definition stage , and continue to be package design expert throughout project phase Actively  scout for new packaging technologies and keep in touch with package development at competitors/subcons Be the  main contact person and  technical consultant/coach for all questions and discussion regarding packaging, package design and Package Drive innovation  and  pre development activities within the package platform Consolidate the  inputs for BDR  and ensure the contents are updated (A project) Generate technical papers / journals and patents related to package technology Your profile Qualifications and skills to help you succeed  You strive to leverage deep expertise in semiconductor packaging, assembly, and test technologies , with a strong understanding of BE processes, materials, package reliability, and quality requirements to develop robust and innovative packaging solutions. You demonstrate strong analytical, communication, negotiation, and stakeholder management skills , enabling effective cross-functional collaboration and the successful resolution of complex technical and business challenges. Bachelor’s Degree in  Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics) At least  >10 years of working experience in IC/semiconductor environment Experience in Semiconductor Packaging, Assembly and Test Excellent technical knowledge of BE processes and  materials in plastic packages  and interaction to the different functions  (interaction of BOM, package construction, design rules and process) Good understanding of Automotive quality requirement s  and standards Good knowledge on the internal package analysis and  first level reliability  Strong analytical skills , ability to deal with conflict  and  ambiguity Strong communication , negotiation skills  and  s takeholder management skills across all levels Good knowledge on  flip-chip technology  would be advantageous #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.  Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.