STAFF ENGINEER, DRY ETCH DRAM

Req ID:

JR105413 STAFF ENGINEER, DRY ETCH DRAM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are part of Micron’s DRAM Technology Development organization, advancing dry etch technology for future memory generations. Our team works at the intersection of plasma science, device integration, and manufacturing, developing processes that directly influence performance, yield, and scalability. We collaborate closely across process areas to solve challenging technical problems and accelerate technology learning!

As a DRAM Dry Etch Engineer, you will develop and optimize plasma etch processes that enable next-generation memory devices. You will work in a research and development environment, taking concepts from early development through manufacturing implementation. This role offers broad technical ownership, hands-on experimentation, and opportunities to shape future technology roadmaps.

Responsibilities:

• Develop and optimize dry etch processes to meet structural and electrical requirements
• Collaborate with integration and process teams to solve complex device and process challenges
• Perform root cause analysis and drive yield, defect, and process improvements
• Analyze data to improve process capability, stability, and manufacturing readiness
• Support process transfer, project execution, and production issue resolution

Minimum Qualifications:

• MS or PhD with 3–5 years of relevant experience, or BS with 5–10 years of semiconductor experience
• Experience in dry etch process development within semiconductor manufacturing or R&D
• Understanding of plasma physics, dry etch chemistries, and reactor fundamentals
• Experience using statistical methods, SPC, and data-driven problem solving
• Ability to manage different projects and work effectively across teams

Preferred Qualifications:

• Experience with DRAM process or module ownership
• Hands-on experience with ICP and CCP dry etch systems
• Knowledge of transport phenomena, surface interactions, and plasma processes
• Experience with FMEA, 8D, or advanced defect analysis methodologies
• Experience Leveraging AI to improve data analysis, process optimization, or engineering workflows

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Job Profile(s):

Semiconductor Process Engineer 4

Relocation Level: TBD

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