Principal Engineer – Process Development, Dry Etch, NAND

Req. ID:

JR100830 Principal Engineer – Process Development, Dry Etch, NAND (Evergreen)

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Job / Role Summary

The Principal Engineer provides technical leadership for dry etch process development across critical NAND modules, shaping process roadmaps for current and future nodes and leading cross-functional execution to solve high-impact structural and device challenges. Success requires deep domain expertise in plasma etch, proven leadership in complex program delivery, and strong vendor engagement to close technology gaps.

Main Responsibilities

• Lead dry etch unit process and critical module development; develop/innovate processes that meet advanced NAND structural and electrical specifications.

• Lead cross-functional teams to solve complex structural problems and drive alignment across process areas.

• Present and drive dry etch process and technology roadmaps for current and future technology nodes.

• Drive advanced scalability solutions for high aspect ratio etches, including pulsing/advanced schemes where applicable.

• Lead supplier head-to-heads and vendor engagements to accelerate process/hardware solutions.

Other Responsibilities

• Provide technical mentorship and act as a resource for peers in dry etch technology and project execution.

• Provide critical status and risk updates to leadership stakeholders.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥5 yrs, or Master’s ≥7 yrs, or Bachelor’s ≥10 yrs of relevant experience in

Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,

• Significant dry etch PD/R&D experience with evidence of leading complex projects and cross-functional delivery (the current Staff/Principal requisition uses MS/PhD and BS experience ranges).

Must-have technical skills

• Deep dry etch technology fundamentals (plasma physics/chemistry, reactor types/chemistries) and ability to apply mechanistic reasoning to outcomes.

• Strong SPC/DOE/statistical analysis and structured RCA.

Must-have soft skills

• Technical leadership through influence; ability to drive alignment and execution across multiple stakeholders and sites.

• Strong communication and ability to present roadmaps and program updates.

Highly desirable / preferred

• Data science basics / Python and AI-enabled analysis capability.

Embody Micron’s core values:

• People – Respect, develop and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

Job Profile(s):

Semiconductor Process Engineer 5

Relocation level: (TBD)

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