Jobs
Micron
Package Development Engineering – Product Integration Engineer (PDE PIE)
Hiring
.Camp
Package Development Engineering – Product Integration Engineer (PDE PIE)
Micron
•
Apr 14, 2026
MSB, Singapore
Engineering
Ready to apply?
Opens Micron's career page
Apply Now
Back to jobs
Similar Jobs
13
ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION
Micron
MSB, Singapore
Save
Mark Applied
Apply
ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION
Micron Technology
SG
Save
Mark Applied
Apply
Intern – Package Development Engineering (Advanced Packaging, High Bandwidth Memory & New Product Introduction)
Micron Technology
SG
Save
Mark Applied
Sr. Specialist Package Engineering & Development
Morphe
Save
Mark Applied
Package Development Engineering – Product Integration Engineer (PDE PIE)
Micron Technology
Singapore, Singapore
Save
Mark Applied
Sr. Specialist Package Engineering & Development
Morphe
Los Angeles Office +2 more
Save
Mark Applied
Apply
ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION
Micron
MSB, Singapore
Save
Mark Applied
Apply
Engineer, Process Integration PDE (Package Development Engineering)
Micron
MSB, Singapore
Save
Mark Applied
Apply
Engineer, Yield Enhancement PDE (Package Development Engineering)
Micron
MSB, Singapore
Save
Mark Applied
Apply
Staff Engineer, Package Development & Engineering
Micron Technology
Save
Mark Applied
Apply
Staff Engineer, Package Development & Engineering
Micron Technology
Save
Mark Applied
Apply
Staff Engineer, Package Development & Engineering
Micron
MSB, Singapore +1 more
Save
Mark Applied
Apply
Staff Engineer, Package Development & Engineering
Micron
MSB, Singapore +1 more
Save
Mark Applied
Apply