Advanced Packaging Inspection (Mantis-D) Process Support Engineer

Key Responsibilities

• Develop deep expertise in semiconductor advanced packaging processes and customer manufacturing flows to identify inspection challenges, technology gaps, and yield improvement opportunities, driving solutions through successful implementation.

• Serve as the technical lead for Kinex Mantis-D Integrated Module Inspection systems, including advanced macro optical inspection applications for HBM, 2.5D/3D packaging, Hybrid Bonding, and next-generation package integration technologies.

• Lead customer evaluations, demos, beta-site activities, process qualifications, and proof-of-concept projects, ensuring alignment with statement of work (SOW), project milestones, and customer deliverables.

• Interface directly with customer engineering, process integration, yield, quality, and manufacturing teams to define inspection requirements, optimize recipes, and establish roadmap alignment.

• Define and approve application deployment plans, process qualification strategies, and customer acceptance criteria for system installation and production ramp.

• Develop and lead innovative inspection methodologies utilizing advanced macro optical inspection technologies, machine vision, AI-based defect classification, and integrated inspection solutions to maximize system performance and defect detection capability.

• Analyze, develop, validate, and transfer new application capabilities from product division and R&D organizations to regional customer support teams, ensuring successful adoption in production environments.

• Lead customer technical review meetings, technology roadmap discussions, and executive-level engagements related to package inspection strategy and manufacturing requirements.

• Collaborate closely with global product engineering, marketing, software, and hardware teams to influence product roadmap development for future packaging inspection requirements.

• Support business growth initiatives by identifying customer pain points, competitive gaps, and new application opportunities within advanced packaging inspection markets.

Functional Knowledge

• Demonstrates advanced expertise in semiconductor advanced packaging processes and macro optical inspection technologies, with strong understanding of defect inspection, process control, metrology, and yield enhancement methodologies.

• Possesses working knowledge of related Package inspection technologies, including optical inspection, defect review, and AI-driven analytics.

Business Expertise

• Understands semiconductor packaging market trends, customer technology roadmaps, and competitive inspection solutions.

• Applies industry best practices to support customer manufacturing challenges while contributing to business expansion and market share growth.

• Maintains awareness of industry developments in HBM, AI packaging, hybrid bonding, chiplet integration, and advanced package manufacturing.

Leadership

• Acts as a technical mentor and subject matter expert for regional and global application teams.

• Leads cross-functional project teams supporting complex customer engagements and strategic technology programs.

• Provides technical leadership during customer escalations, production ramp activities, and critical business opportunities.

Problem Solving

• Solves highly complex inspection and process challenges by integrating knowledge of package manufacturing, optical inspection technologies, software algorithms, and customer production requirements.

• Analyzes multiple sources of technical and manufacturing data to identify root causes, recommend solutions, and improve inspection effectiveness.

• Develops innovative approaches to address emerging inspection challenges in next-generation advanced packaging applications.

Impact

• Directly impacts customer yield improvement, quality control effectiveness, production ramp success, and overall business growth.

• Influences product strategy, application development priorities, and customer adoption of advanced inspection technologies.

• Supports strategic customer accounts through successful deployment of inspection solutions and achievement of factory production targets.

Interpersonal Skills

• Communicates complex technical concepts effectively to engineers, managers, executives, and customers.

• Builds consensus among cross-functional organizations and customer stakeholders to drive project success.

• Demonstrates strong presentation, negotiation, and customer engagement skills in global environments.

Requirements

• 6+ years of experience in semiconductor manufacturing, inspection, metrology, yield engineering, or advanced packaging technologies.

• Strong knowledge of semiconductor package processes, including HBM, hybrid bonding, chiplet integration, wafer-level packaging, and advanced substrate technologies.

• Hands-on experience with optical inspection systems, machine vision applications, defect inspection methodologies, or process control solutions.

• Experience leading customer-facing technical projects, evaluations, and production qualifications.

• Knowledge of semiconductor inspection technologies such as optical inspection, defect review, metrology, or related systems.

• Strong project management, technical leadership, and problem-solving skills.

• Excellent English communication and presentation skills.

• Ability to travel internationally as needed (20~30%).

## Qualifications

### Education:

Bachelor's Degree

### Skills

### Certifications:

### Languages:

### Years of Experience:

2 - 4 Years

### Work Experience:

## Additional Information

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### Shift:

Day (Korea, Republic of)

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### Travel:

###

### Relocation Eligible:

No

### Referral Payment Plan:

None

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.