Hiring.Camp

Principal Engineer – RV (EM/IR)

Qualcomm

·

1 week ago

Location
Bengaluru, KA,IN, IN
Type
Full-time
Department
Engineering
Seniority
Lead
Experience
10+ years
Education
PhD
Source
Eightfold

Description

##

Company:

Qualcomm India Private Limited

## Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience.

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 7+ years of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.

We are looking for an experienced Principal Engineer – RV (EM/IR) to lead power integrity and reliability signoff activities for advanced-node SoC designs. In this role, you will drive IR drop and electromigration (EM) analysis, define signoff methodologies, and collaborate with cross-functional teams to achieve robust and reliable silicon implementation. The ideal candidate should possess deep expertise in power integrity analysis, a strong understanding of advanced-node challenges, and proven experience in leading signoff closure for complex chip designs.

What You’ll Do

  • Lead full-chip and block-level IR drop and electromigration (EM) analysis for advanced-node SoC designs
  • Drive power integrity signoff closure by identifying, debugging, and resolving IR/EM violations
  • Collaborate with Physical Design, Power, Package, and Foundry teams to optimize power delivery networks
  • Define and improve EM/IR methodologies, automation flows, and signoff strategies
  • Perform static and dynamic IR analysis across multiple operating conditions and scenarios
  • Analyze power grid robustness, current density, and thermal impacts to ensure design reliability
  • Support tapeout activities and ensure high-quality signoff delivery within project timelines

What We’re Looking For

  • Bachelor’s or Master’s degree in Electronics, Electrical Engineering, or VLSI-related discipline
  • 10+ years of experience in IR/EM analysis, power integrity, or Physical Design signoff
  • Strong understanding of power integrity concepts including static/dynamic IR drop, EM analysis, and power grid optimization
  • Hands-on experience with industry-standard tools such as Cadence Voltus, Ansys RedHawk, or equivalent
  • Good understanding of Physical Design flow including floorplanning, placement, CTS, routing, and extraction
  • Strong scripting skills in Tcl, Python, Perl, or Shell for automation and flow development

Good to Have

  • Experience with advanced technology nodes such as 7nm, 5nm, 3nm, or below
  • Exposure to package-aware analysis, thermal analysis, and low-power methodologies
  • Experience in leading signoff closure for large-scale SoC or high-performance compute designs

Success in This Role Looks Like

  • Achieving robust IR/EM signoff with minimal iterations and successful tapeout execution
  • Early identification and resolution of power integrity risks impacting performance and reliability
  • Improved signoff productivity through methodology enhancements and automation initiatives
  • Strong technical leadership and collaboration across implementation and signoff teams

Location

On-site – Bengaluru

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.

Skills

PythonPerl

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Principal Engineer – RV (EM/IR) at Qualcomm | Hiring.Camp