- Location
- MY Ipoh, Malaysia
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Source
- Workday
Description
- Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devices
- Ensures that the appropriate documents are in place for all new & existing design changes in PDM
- Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturability
- Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively.
- Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantage
- Performs other functions as may be assigned from time to time by superior.
Job Specification
- Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) Software
- Skills: Excellent Computer skills
- Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design
Skills
AutoCAD