- Location
- Wuxi, Jiangsu,CN, CN
- Type
- Full-time
- Department
- Engineering
- Seniority
- Lead
- Source
- Eightfold
Description
Drive reliability robustness for WB-related failure mechanisms (e.g., NSOP/NSOL, wire sweep, heel crack, IMC-related degradation, corrosion/Al pad damage, Cu oxidation, cratering, stitch/bond lift, EFO variability as applicable). Your role Key responsibilities in your new role Lead investigations into critical excursions and systematic issues using structured methods (8D, DMAIC, DoE, FMEA, Fault Tree Analysis), delivering clear root cause and permanent corrective actions.
Drive reliability robustness for WB-related failure mechanisms (e.g., NSOP/NSOL, wire sweep, heel crack, IMC-related degradation, corrosion/Al pad damage, Cu oxidation, cratering, stitch/bond lift, EFO variability as applicable).
Support qualification and monitoring: pull/shear, ball/stitch geometry, intermetallic growth, microsectioning, SAM/X-ray, and environmental stress results interpretation.
Define key parameters and interactions (US power/force/time, scrub, bonding temperature, EFO, N₂ forming gas, clamp settings, loop profile, ultrasonic transducer health).
Mentor senior engineers and act as a technical reviewer for WB-related changes, deviations, and risk assessments.
Partner with package design, device design, wafer fab (pad stack), materials, equipment engineering, test, and quality to ensure end-to-end manufacturability and reliability.
Interface with suppliers (wire, capillaries, bonders, consumables) and drive joint development, supplier qualification, and change management.
Drive digitalization and automation projects with the vision of autonomous factories. Your profile Qualifications and skills to help you succeed 8–15+ years in semiconductor assembly/packaging with deep expertise in wire bonding (Al/Cu/Au) Proven HVM ownership strongly preferred.
Strong understanding of bonding physics, metallurgy/intermetallics, pad stack interactions, contamination control, corrosion mechanisms, and thermal-mechanical effects.
Solid experience with process characterization and statistics: SPC, Cp/Cpk, MSA, GR&R, DoE, capability studies.
Hands-on familiarity with metrology/failure analysis methods relevant to WB (pull/shear, microsections, SEM/EDS as available, X-ray/SAM).
Demonstrated ability to lead cross-site/cross-functional teams without direct reporting lines; confident in technical decision-making and escalation handling. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. [email protected] [email protected]