Mechanical Engineer 3

Lead mechanical subsystem development projects for semiconductor equipment hardware from concept to production release, supporting New Product Development (NPD), Continuous Improvement Programs (CIP), cost reduction, productivity enhancements, and reliability improvement initiatives. Collaborate with cross-functional teams (CFTs) including engineering, manufacturing, supply chain, quality, and suppliers to define product requirements, align technical objectives, evaluate design options, and drive successful project execution. Develop innovative mechanical design concepts and translate requirements into robust subsystem solutions using appropriate materials, including metals, ceramics, quartz, plastics, and advanced coating/plating technologies. Perform engineering design, CAD modeling, and detailed documentation, ensuring compliance with Lam standards, SEMI standards, and applicable industry standards (ANSI, DIN, ASME, etc.), while following Best Known Methods (BKMs). Conduct engineering analyses and design evaluations to characterize and optimize product performance, including structural, thermal, vibration, fluid/gas flow, manufacturability, reliability, and cost considerations. Partner with suppliers and manufacturing teams to ensure designs are manufacturable, cost-effective, scalable, and meet performance requirements throughout the product lifecycle. Develop and execute test plans that generate characterization data required to verify, validate, and qualify hardware designs against product requirements and customer expectations. Analyze test results and drive design improvements, ensuring technical risks are identified, mitigated, and resolved through data-driven engineering decisions and design reviews. Prepare and present high-quality technical reports, design reviews, and project updates that effectively communicate design intent, analysis results, validation outcomes, risks, and recommended actions to stakeholders and management. Manage engineering documentation, BOMs, and product releases by following Product Development & Release (PDR) and Engineering Change Management processes to obtain required approvals and ensure configuration integrity. Support pilot builds, product qualification, and High-Volume Manufacturing (HVM) readiness, addressing design-related issues, implementing corrective actions, and driving continuous improvement. Provide timely technical support and resolution for customer, field, and manufacturing escalations, collaborating with global product and support teams to ensure rapid issue resolution and sustained product performance. Ability to work well in a matrix organization with aggressive deadlines, ability to align on priorities, etc. while focused to realize end objective. Application knowledge: hands-on experience on any CAD (NX is preferred) with design, drawing, drawing standards & GD&T. Hands on experience to take design from concepts (OEM components, sheet metal, metal (machined & weld assy), plastics & ceramics would be a big plus), detail engineering (Tolerance analysis, DFMEA, 8D problem solving, RCCA, 5-why, DFMA), Test plan, Testing, etc. & through detailed drawing, parts procurement, DFM interaction with suppliers, assembly, test, build verification, field/customer qualification with deeper understanding of issues faced, lessons learned and closure. Ability to identify all technical risks and mitigate them through appropriate calculations; structural, strength, seismic, tipping, flow, thermal & combinations of these. Accountable for releasing complete engineering drawings & bill of materials per “Engineering Change Management Process” consistent with “DFMA, DFX, & DFMEA”. Bachelor's in Mechanical Engineering with a minimum of 8 years of relevant experience, or Master's in Mechanical Engineering with a minimum of 4 years of relevant experience. Excellent verbal and written communication skills; ability to present design concepts to peers and management in a professional and effective way. Critical thinker with proven ability to create solutions for complex engineering problems with an ability to learn new skills quickly with minimal guidance. Ability to perform simple and medium complexity stress analysis using software like NX Nastran, Ansys to verify the design. Understanding of Process & Instrumentation Drawings (P&ID). Knowledge in Engineering Change Management Process, SAP, PLM. Experience in Value Engineering; should costing, cost reduction would be an advantage. Exposure to obsolescence management in product engineering, including understanding how to handle an obsolete part/sub-assembly in a mature product and how to qualify a replacement part. Creative thinking & innovation, collaboration, teamwork approach, and project planning skills. Knowledge and exposure to ANSI, ASME, SAE, ISO, and SEMI standards applicable to the semiconductor industry. Experience in project management, problem solving while managing time and multiple priorities.