Director Development

Shape the future of package technology. As Director Development, you will lead a high-performing Package Technology Development team, driving innovation from early concepts through industrialization and production. You will influence global package strategy, strengthen technical capabilities, and collaborate across international development locations to deliver cutting-edge solutions with the right balance of cost, manufacturability, quality, and speed. Your role Key responsibilities in your new role Lead the Package Technology Development team Responsible

for package development activities , including: Package definition Concept engineering Reverse engineering Technology Integration Innovation and technology development Build team capabilities and competencies to drive high performance in new package

and technology concepts, from idea generation through project

realization and productio As

part of the management team , drive key development targets,

including Design-to-Cost, Design-for-Manufacturing, Design-for-Quality ,

and Time-to-Market Lead

problem-solving activities, focus teams, and task forces across development projects to ensure

successful delivery of agreed target Support the Development Head in defining the

department strategy and package development roadmap to enable

business success and maintain technology leadership Represent the Development function and collaborate

with Business Divisions and global development locations , including

Munich, Villach, Regensburg, and Kulim, on package concepts, strategy,

and execution .  Drive technical leadership and capability development across key package development

disciplines, including concept engineering, material engineering, and

unit process engineering . Your profile Qualifications and skills to help you succeed  Master’s or Bachelor’s Degree in Electrical, Electronics, Microelectronics, Mechanical, Materials

Engineering , or a related engineering discipline. Minimum 10 years of experience in the semiconductor industry or a related field. Proven leadership experience managing a team of 20+

professionals , including engineers, staff engineers, and team managers. Proven experience in developing and industrializing new package

technologies , from concept through production.  Strong understanding of Design-for-Manufacturing, Design-for-Quality,

and Design-to-Cost principles.

Strong problem-solving, stakeholder management, and cross-functional

collaboration skills , with the ability to work effectively across global

development teams. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.  Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Mandy Neoh