- Location
- Penang 15, Penang, Malaysia
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Experience
- 10+ years
- Source
- Workday
Description
Job Details:
Job Description:
Position Overview
Altera is seeking an experienced Senior Mechanical Engineer to lead the mechanical design and thermal engineering of engineering validation boards, FPGA platform prototypes, PCIe cards, accessories cards, and Altera Development Kits. This role converts system, board, package, power, and application requirements into robust, manufacturable hardware solutions—from early concept and CAD architecture through simulation, prototype build, validation, and production release. The ideal candidate brings 10+ years of hands-on experience, strong technical judgment, and a track record of delivering complex electronics platforms in partnership with electrical, silicon, package, validation, manufacturing, and supplier teams.
What You Will Do
Own mechanical architecture for engineering validation boards, FPGA development platforms, PCIe cards, accessories cards, evaluation systems, and related accessories, balancing performance, reliability, schedule, cost, and manufacturability.
Create and maintain detailed 3D CAD designs, assemblies, layouts, and production drawings using Creo and/or SolidWorks; define interfaces, mounting schemes, board keep-outs, stack-ups, brackets, covers, enclosures, sockets, and heatsink assemblies.
Develop heatsink and thermal-management solutions for high-power FPGA and board-level designs, including thermal interface materials, airflow paths, fans, heat spreaders, conduction paths, and mechanical retention features.
Perform and interpret thermal simulations using ANSYS Icepak, FloTHERM, CFD, or equivalent tools to predict temperature, airflow, pressure drop, and thermal margin; correlate models with lab measurements and drive design iterations.
Lead tolerance analysis, structural checks, vibration/shock considerations, thermal-mechanical stack-up reviews, and design-for-reliability assessments for prototype and production-intent hardware.
Drive design execution from requirements and feasibility through concept reviews, design reviews, prototype fabrication, engineering validation, issue resolution, and release of complete technical documentation.
Plan and support hands-on bring-up and validation activities, including fit and function checks, environmental testing, failure analysis, and root-cause/corrective-action closure.
Partner with electrical, PCB, silicon, package, power, signal integrity, validation, compliance, and program teams to resolve cross-domain constraints and deliver platform-level solutions with minimal iteration.
Collaborates with thermal engineers to optimize the design parameters, deliver performance objectives, and partner with external vendors through initial conceptual studies, layout, design, fabrication, assembly, and validation.
Engage contract manufacturers, machining houses, sheet-metal and injection-molding suppliers, and component vendors on DFM/DFA, tooling, material selection, cost, lead time, quality, and production readiness.
Establish and communicate mechanical/thermal risks, assumptions, trade-offs, schedules, and mitigation plans to engineering leadership and program stakeholders; mentor engineers and raise the team’s design and simulation standards.
Maintain accurate CAD databases, drawings, specifications, simulation reports, validation data, change records, and technical presentations in accordance with Altera engineering processes.
Qualifications:
Minimum Qualifications
Bachelor’s degree in mechanical engineering or a closely related engineering discipline; advanced degree is a plus.
10+ years of professional experience in mechanical design and engineering for complex electronics, computing, semiconductor, FPGA, networking, or instrumentation platforms.
Demonstrated hands-on proficiency with Creo and/or SolidWorks for complex part, assembly, enclosure, board-level, and heatsink design; able to produce clear, release-quality drawings.
Hands-on experience with thermal simulation tools such as ANSYS Icepak, FloTHERM, or equivalent CFD/thermal modeling platforms, including model setup, boundary conditions, interpretation, and lab correlation.
Strong understanding of heat transfer, conduction, convection, thermal resistance networks, airflow management, thermal interface materials, heat sinks, heat spreaders, and temperature measurement techniques.
Experience designing mechanical solutions around PCBs, high-speed/PCIe cards, sockets, connectors, FPGA packages, board stiffeners, retention hardware, and system-level interfaces.
Working knowledge of tolerance analysis, DFM/DFA, material selection, and manufacturing processes such as CNC machining, sheet metal, injection molding, die casting, and additive manufacturing.
Proven ability to lead technical work across multiple projects, make sound engineering trade-offs, and communicate effectively with global cross-functional teams and external suppliers.
Ability to travel occasionally to support prototype builds, supplier engagements, design reviews, and validation activities.
Preferred Qualifications
Experience with FPGA development kits, engineering validation boards, reference platforms, accelerator cards, or semiconductor evaluation systems.
Experience developing high-power heatsink assemblies, fan/duct solutions, heat pipes, vapor chambers, cold plates, or conduction-cooled platforms.
Familiarity with thermal, structural, vibration, shock, acoustic, EMC/EMI, safety, and environmental requirements for electronics hardware.
Experience with design verification plans, validation methods, DOE, test instrumentation, thermal chambers, data acquisition, and engineering change processes.
Proficiency with 2D drafting and drawing standards, PLM/PDM systems, Microsoft Office automation, and technical data/reporting tools.
Experience mentoring engineers, setting design guidelines, reviewing technical work, and influencing platform architecture without direct authority.
