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SR. HBM Stacking Process Engineer

Micron Technology

·

Jul 9, 2025

Location
Taichung City,TW, TW
Type
Full-time
Department
Engineering
Education
Master
Source
Eightfold

Description

Identify, diagnose and resolve assembly process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Support SPC/FDC/RMS/APC Support site to site portability Manage / audit material suppliers to achieve quality, cost and risk management objectives Support internal and external audits Preferred to have over 5-year of working experiences in production line or engineer background​ Process experienced-on Flip chip bonding(FCB)/ Die bond(DB)/Grinding ​ CIP experienced-on DOE/yield improvement/UPH enhancement​ Conversation English with TOEIC 650 scores.​ Master degree or above.

Skills

Risk Management

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