Hiring.Camp

Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND

Micron Technology

·

May 6, 2026

Location
SG
Type
Full-time
Department
Engineering
Seniority
Senior
Education
PhD
Source
Eightfold

Description

Req. ID:

JR100840 Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND (Evergreen)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job / Role Summary

The Staff Engineer delivers module/sub-module ownership in NAND Advanced Thin Films process development, owning defined portions of the process space (dielectric/carbon film processes via CVD/Diffusion) and driving robustness, capability, and integration readiness. Success requires strong hands-on deposition/characterization skills, cross-functional execution discipline, and the ability to translate experimental results into scalable process improvements.

Main Responsibilities

Process Development & Optimization

  • Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
  • Execute well-designed experiments, analyze data, and translate results into process improvements.
  • Support scaling of dielectric and carbon film processes across nodes and platforms.

Module Ownership (Growing Scope)

  • Own defined portions of a process module or sub-module under guidance from senior engineers; track margins, sensitivities, and integration risks.
  • Drive issue resolution for process and tool-related problems within assigned scope.

Process Integration & Correlation

  • Work closely with integration and device teams to ensure compatibility and structural/electrical performance.
  • Correlate material, structural, and electrical data to guide process optimization; support failure analysis and root-cause investigations.

Tool & Hardware Engagement

  • Build strong hands-on knowledge of dielectric/carbon film equipment behavior; support tool qualifications, upgrades, and transfers; partner with suppliers to improve stability/capability.

Other Responsibilities

  • Communicate results clearly through reports, reviews, and data summaries; escalate risks with data-driven recommendations.
  • Mentor junior engineers and contribute to team knowledge sharing.
  • Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
  • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work

Candidate Profile

Minimum Qualifications / Experience

  • PhD ≥3 yrs, or Master’s ≥5 yrs, or Bachelor’s ≥7 yrs of relevant experience in

Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,

  • Demonstrated thin film R&D / PD experience and ability to link process conditions to material properties/device behavior.

Must-Have Technical Skills

  • Thin film deposition fundamentals (CVD/Diffusion) and materials/chemistry/process physics.
  • Familiarity with fab metrology and film characterization methods (structural/mechanical/optical/electrical as applicable).
  • Working knowledge of plasma processes, vacuum systems, and chemical reactions.

Must-Have Soft Skills

  • Strong execution ownership and structured troubleshooting.
  • Cross-functional collaboration and concise technical communication.

Highly Desirable / Preferred

  • Understanding NAND thin film structure and electrical needs.

Embody Micron’s core values:

  • People – Respect, develop and empower others
  • Innovation – Drive continuous improvement and breakthrough thinking
  • Tenacity – Show grit and determination
  • Collaboration – Build trust and foster teamwork
  • Customer Focus – Deliver excellence and value

Job Profile(s):

Semiconductor Process Engineer 4

Relocation level: (TBD)

Before Getting Started

Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

  • Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
  • If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

​​​​

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND at Micron Technology | Hiring.Camp