Design Engineer

Key Responsibilities

· Develop finite element models to evaluate thermal and mechanical behavior of semiconductor packages under guidance from senior engineers.

· Perform thermo-mechanical reliability modeling to assess package response under assembly and operating conditions, including process-induced stress, thermal cycling, warpage, interfacial loading, and potential failure risks.

· Simulate stress, strain, warpage, interfacial loading, thermal cycling response, and other reliability-related behaviors in structures such as flip-chip, fan-out, 2.5D/3D IC, chiplet, and TSV-based packages.

· Build and refine thermal models to study temperature distribution, heat flow, and the impact of package materials and geometry.

· Perform mesh convergence, sensitivity, parameter sweep, and design-of-experiment studies; summarize the dominant physical drivers.

· Collect material properties and package/process inputs from literature, experiments, and cross-functional partners; document assumptions and data sources.

· Compare simulation results with analytical solutions, experimental data, or benchmark models and investigate discrepancies.

· Create scripts, templates, and post-processing utilities to improve modeling repeatability and efficiency.

· Prepare concise technical reports and presentations explaining methods, results, limitations, and recommended next steps.

· Contribute to team knowledge sharing, model documentation, and continuous improvement of simulation best practices.

# Required Qualifications

· Ph.D. in Mechanical Engineering, Materials Science, Applied Mechanics, Applied Physics, or a closely related field, completed recently or expected before start date.

· Strong foundation in finite element methods, solid mechanics, heat transfer, thermodynamics, and mechanics of materials.

· Hands-on research experience using ANSYS, Abaqus, COMSOL, or an equivalent FEA platform.

· Ability to formulate engineering problems, define appropriate boundary conditions, evaluate numerical quality, and interpret results using physical reasoning.

· Experience with data analysis or scripting using Python, MATLAB, or a similar language.

· Clear written and verbal communication skills and the ability to collaborate in a multidisciplinary environment.

# Preferred Qualifications

· Doctoral research related to electronics packaging, composite materials, fracture or interface mechanics, polymers, reliability, thermal management, or manufacturing processes.

· Exposure to advanced packaging technologies such as FOWLP, hybrid bonding, chiplets, HBM, TSVs, or 2.5D/3D integration.

## Qualifications

### Education:

Bachelor's Degree

### Skills

### Certifications:

### Languages:

### Years of Experience:

4 - 7 Years

### Work Experience:

## Additional Information

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### Shift:

Day (Singapore)

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### Travel:

Yes, 10% of the Time

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### Relocation Eligible:

No

### Referral Payment Plan:

Employee Referral (Standard)

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.