Advanced Packaging Metallization Segment Leader

Position Summary

Qnity is seeking an Advanced Packaging Metallization Segment Leader. This position is responsible for driving strategic growth within the advanced packaging market by identifying emerging opportunities, developing market-driven business strategies, and translating customer and technology insights into actionable growth initiatives. This role partners closely with sales, product management, R&D, and marketing teams to expand market share, strengthen customer relationships, and position Qnity as a leader in advanced packaging solutions.

This is a hybrid position based in Wilmington, Delaware. Priority will be given to candidates currently living within a daily commutable distance to this location.

Please note: Sponsorship is not available now or in the future for this opportunity.

What You'll Do

• Develop and execute market growth strategies that drive revenue, profitability, and market share expansion.

• Identify, prioritize, and lead strategic business opportunities, new product initiatives, and market development efforts.

• Analyze market trends, customer needs, technology roadmaps, and competitive activity to inform business strategy and investment decisions.

• Lead Voice of Customer (VOC) initiatives to uncover unmet needs, emerging applications, and future growth opportunities.

• Translate industry trends and customer requirements into material, technology, and solution strategies that support business objectives.

• Monitor key market indicators and business performance metrics, providing actionable insights to leadership and cross-functional teams.

• Collaborate with sales, product management, marketing, and technology teams to drive execution of strategic initiatives and ensure successful commercialization efforts.

• Support digital marketing and thought leadership activities that enhance brand visibility, customer engagement, and market presence.

What We're Looking For

Minimum Qualifications

• Bachelor's degree in Chemistry, Chemical Engineering, Materials Science, or a related technical discipline.

• 10+ years of experience within the semiconductor industry, including OEMs, Foundries, OSATs, design houses, equipment suppliers, or related technology organizations.

• Minimum 5 years of direct experience in advanced packaging technologies, including Wafer Level Packaging (WLP), Fan-Out (FO), 2.5D/3D packaging, and heterogeneous integration.

• Experience in product marketing, business development, product management, sales, or related commercial roles.

• Demonstrated ability to influence and lead cross-functional teams without direct authority.

• Strong business acumen, analytical thinking, and problem-solving capabilities.

• Excellent communication and presentation skills with the ability to effectively communicate both technical and business concepts.

• Proven ability to manage multiple priorities in a fast-paced, evolving environment.

• Fluency in English.

Preferred Qualifications

• Master's degree, PhD, or MBA.

• Experience in R&D, applications engineering, or technology development.

• Direct customer-facing experience in the semiconductor or advanced packaging industry.

• Proven track record of driving innovation, market expansion, and business growth initiatives.

• Strong project management and strategic planning experience.

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