Signal Integrity Lead

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Company:

Qualcomm Technologies, Inc.

## Job Area:

Engineering Group, Engineering Group > Systems Engineering

General Summary:

The Qualcomm Data Center team is developing high-performance, energy-efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work.

Our Mission

We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.

Position: Signal Integrity Lead

We are seeking a Signal Integrity Lead to provide technical and people leadership across Qualcomm's data center server platforms. In this role, you will lead and grow a team of signal integrity engineers while collaborating closely with platform, silicon, packaging, firmware, and component engineering teams.

You will be responsible for establishing SI methodology, validation strategy, design guidelines, and product-level signoff criteria across memory and SerDes interfaces, package-to-board integration, PCBs, cables, and system interconnects. The role requires close collaboration with silicon and package design organizations to assess die/package SI solutions and ensure successful integration into Qualcomm server products.

Key Responsibilities

• Lead, develop, and grow the Signal Integrity team, including hiring, coaching, career development, performance management, and resource planning across multiple programs.

• Define signal integrity strategy, methodology, and best practices across Qualcomm data center products.

• Collaborate with SoC, applications engineering, packaging, and system design teams to develop system interconnect solutions that meet performance, reliability, and scalability requirements.

• Collaborate with silicon and package design teams to review and validate die/package signal integrity solutions and approve their integration into the final server product.

• Provide guidance and feedback on silicon timing, bump/RDL implementation, package pinout, PCB specifications, connector selection, and channel architecture.

• Establish design rules, signoff criteria, correlation plans, and validation processes for high-speed interfaces.

• Develop customer guidelines and define model formats and interfaces for simulation and system integration.

• Lead the development of SI models, simulation frameworks, and analysis flows across memory and high-speed serial interfaces.

• Assess early SI analysis of advanced packaging technologies, including 2.5D and 3D integration structures, and establish system-level integration guidelines.

• Drive system-level SI architecture spanning package-to-board interfaces, PCB, connectors, cables, chassis, and future rack-level interconnects.

• Update and automate design and analysis flows to improve productivity, accuracy, and scalability.

• Partner with cross-functional teams to resolve complex SI issues and drive technical decision-making throughout product development.

• Prepare and present technical documentation, design reviews, and recommendations to engineering teams, senior leadership, customers, and suppliers.

Qualifications

• Master's degree in Electrical Engineering, Computer Engineering, or a related field.

• 10+ years of experience in signal integrity analysis, simulation, and validation of high-speed digital systems.

• Experience managing a signal integrity engineering team.

• Strong knowledge of SI fundamentals, including transmission line theory, channel analysis, crosstalk, S-parameters, jitter analysis, and system-level performance optimization.

• Working knowledge of power integrity concepts, including PDN analysis and EMIR considerations.

• Expertise in DDR5/LPDDR6 interfaces and/or high-speed SerDes technologies such as PCIe, CXL, Ethernet, and UCIe.

• Experience developing and correlating SI methodologies from package through system-level implementation and laboratory validation.

• Proficiency with simulation tools such as ANSYS HFSS, Cadence Sigrity, Dassault Systèmes CST, Keysight ADS, and Synopsys HSPICE.

• Hands-on experience creating SI models and performing both frequency-domain and time-domain simulations.

• Proficiency in Unix/Linux environments and scripting for EDA tool automation.

• Strong understanding of packaging and PCB technologies, design methodologies, and manufacturing processes.

• Familiarity with advanced packaging technologies, including CoWoS, InFO, EMIB, RDL, and other 2.5D/3D integration approaches.

• Experience with electrical validation and compliance testing using oscilloscopes, VNAs, TDR systems, protocol analyzers, traffic generators, and related laboratory equipment.

• Demonstrated success building and scaling technical teams, hiring talent, and establishing engineering best practices.

• Strong written, verbal, and presentation skills.

Preferred Qualifications

• Ph.D. in Electrical Engineering, Computer Engineering, or a related field.

• 15+ years of experience in signal integrity analysis, simulation, validation, and architecture of high-speed systems.

• In-depth understanding of computational electromagnetics, signal integrity architecture, and transmission line theory.

• Expertise in DDR5 and LPDDR6 timing budgets, PHY design, link analysis, and margin characterization.

• Experience with PCIe Gen 6+, CXL, Ethernet, UCIe, and 112Gbps+ serial communication channels.

• Experience with package and PCB design tools such as Cadence Allegro.

• Proficiency in MATLAB, Python, Perl, or comparable scripting and automation environments.

• Experience developing server, AI, HPC, data center, or rack-scale computing platforms.

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience.

OR

Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.

OR

PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

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Pay range and Other Compensation & Benefits:

$221,100.00 - $331,700.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.