Hiring.Camp

Summer Intern- WiFi Physical Firmware Engineer

Qualcomm

·

Mar 3, 2026

Location
Hsinchu, Hsinchu City,TW, TW
Type
Full-time
Department
Engineering
Seniority
Internship
Education
Master
Source
Eightfold

Description

Contribute to the design and development of Wi‑Fi PHY‑layer firmware Perform PHY‑layer verification, test development, debugging, and optimization Build verification methodologies, automation flows, and reusable test components Support bring‑up, validation, and analysis on simulated, accelerated, and silicon platforms Utilize AI‑assisted development tools to improve debugging efficiency, code quality, and workflow automation Collaborate with cross‑functional teams in firmware, algorithm, design, and validation Currently pursuing a BS/MS in Electrical Engineering, Computer Engineering, Computer Science, or related field Strong programming skills in C and Python Solid understanding of embedded systems, RTOS fundamentals, and low‑level software concepts Ability to communicate effectively in English Basic familiarity with AI‑assisted coding tools or AI development concepts Knowledge of IEEE 802.11 standards, Wi‑Fi architecture, or wireless communication fundamentals Understanding of networking protocols such as TCP/IP Experience with silicon bring‑up, lab measurement tools, or hardware validation Experience using AI‑based development tools (e.g., Claude, Gemini, LLM‑based debugging)

Skills

PythonTCP/IP

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