Principal Engineer, HIG-HBM Design

Req ID:

JR114348 Principal Engineer, HIG-HBM Design

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Craft and analyze digital and analog circuits used in the development of memory products including simulating, optimizing, and floor planning DRAM circuits. Collaborate with various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to proactively craft HBM products that optimize all manufacturing functions and assure the best performance, power, cost, quality, reliability, time-to-market, and customer happiness. Innovate and integrate end-toend groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence).

Employer will accept a Master’s degree in Electrical Engineering, Physics, Computer Engineering, Semiconductor Engineering or a related field and 10 years of experience in the job offered or in a related field.

Position requires:

1\. High-speed memory design on data paths, from I/O interface to core array 2.

2\. Power domain network analysis

3\. Memory test architectures like MBIST and production silicon validation

4\. Digital design methodologies experience including RTL design, synthesis, and physical implementation

5\. ASIC design development using digital design

6\. Memory core timing, latency control, and signal integrity consideration in advanced designs

Job Profile(s):

Semiconductor Design Engineer 5

Relocation Level: TBD

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