- Location
- Pune, MH,IN, IN
- Type
- Full-time
- Department
- Engineering
- Seniority
- Lead
- Source
- Eightfold
Description
## What you’ll do:
The Lead PCB Design Engineer is responsible for leading the design, development, and optimization of printed circuit board (PCB) solutions for electronic products. This role ensures high-quality, manufacturable, and reliable PCB designs, drives design standardization and process improvements, provides technical leadership, and collaborates with cross-functional teams to deliver innovative and cost-effective products
"• Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release.
- Able to lead Program with multiple PCBs and deliver with help of one or more resources
- Design complex multi-layer PCBs for:
-Data center power distribution and management systems
-Thermal management and cooling control systems
-Know-how of OCP Rack and its structure
-Hands-on experience in High Voltage, High Current PCBs
Develop PCB solutions considering:
-Signal Integrity (SI)
-Power Integrity (PI)
-EMC/EMI compliance
-Thermal performance
-Reliability and Manufacturability
- Define stack-ups, controlled impedance requirements, high-current power routing, grounding strategies, and power distribution networks.
- Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize overall product performance.
- Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities.
- Drive PCB design standardization, library management, design automation, and continuous improvement initiatives.
- Mentor PCB designers and provide technical leadership across global engineering teams."
## Qualifications:
Required: Bachelor’s Degree in Electronics / Electronics and Communication / Electrical Engineering.
"• 12–14 years of PCB design experience in power electronics or thermal management products.
## Skills:
- Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.
"Required:
Strong experience in below:
- Experience with High Power, Flex, Rigid Flex & HDI PCBS.
- High-speed interfaces (DDR, PCIe, Ethernet, USB, SerDes)
- Power electronics and power conversion systems
- Creepage clearance and safety requirements
- SI/PI analysis and simulation
- Thermal-aware PCB design
- DFM, DFA, and DFT methodologies
Well versed with Data Center Rack Architectures, including rack-level power distribution, monitoring, control systems, AI/HPC infrastructure, and cooling solutions.
Good understanding of thermal management technologies including air-cooled and liquid-cooled systems used in modern data centers.
Able to do Power Integrity or Signal Integrity Simulations will be added advantage
Standards & Compliance: Strong working knowledge on below:
- IPC Standards: IPC-2221/2222, IPC-7351, IPC-A-600, IPC-A-610, IPC-6012, IPC-2152 etc.
- Safety & Regulatory Standards: UL, CSA, IEC 62368-1, IEC 61010, IEC 60664, CE, EMC/EMI, RoHS, and REACH
Desired:
- Experience supporting product certification, safety reviews, and regulatory compliance activities is preferred. .
Special:
- CAM validation, check and basic editing of Gerber data using CAM350."
"• Strong leadership, communication, and problem-solving skills.
- Ability to work effectively in cross-functional and global engineering environments. "
