Principal Engineer, Frontend Organizations Central Team, Dry Etch Process

Req. ID:

JR104624 Principal Engineer, Frontend Organizations Central Team, Dry Etch Process (Evergreen)

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities

• Strategize and lead productivity, yield, quality, and cost improvement engagements with global sites and the network team via plasma process optimization, new/FOAK chemistry & hardware qualification, and CIP development collaboration with dry etch suppliers.
• Collaborate with cross-functional teams to drive breakthroughs in defect reduction, particle/residue control, CD uniformity, profile control, and chamber-matching across the global fleet.
• Develop the process and hardware CIP roadmap for Dry Etch — covering chamber parts, RF/match networks, gas delivery, ESC, endpoint, and plasma source upgrades.
• Drive process & hardware improvement with emphasis on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules (Conductor Etch, Dielectric Etch, Poly/Gate Etch, Metal Etch, High-Aspect-Ratio (HARC) Etch, Spacer/ALE, etc.).
• Partner with suppliers to establish equipment start-up acceptance criteria, chamber qualification flows, and tool service requirements; work with global facilities to address new tool installation requirements (abatement, exhaust, RF compliance, gas/chemical infrastructure).
• Improve tool efficiency, WPD, and utilization across all Micron Dry Etch fleets through benchmarking, MAXOUT-style productivity programs, and pathfinding solutions.
• Set up IoT/FDC sensors and advanced chamber telemetry for defense-line strengthening in Dry Etch tools and develop new solutions for excursion prevention and chamber-health monitoring.
• Establish and improve process windows and recipe robustness, upgrade process capability (CD, profile, selectivity, ARDE, LER/LWR control), and reduce production costs (consumable lifetime extension, gas usage optimization).
• Enable new solutions for energy savings (RF power optimization, eco-mode), PFC/F-gas abatement, and waste reduction aligned to Micron's sustainability targets.

Qualifications & Skills

• Proven experience in plasma process and hardware improvement and development within the semiconductor industry, specifically in Dry Etch.
• Remarkable skill in developing and implementing hardware CIP roadmaps and start-up acceptance criteria for dry etch chambers and consumable parts.
• Strong analytical skills for evaluating, promoting, and planning new etch platforms, chemistries, and chamber kits (e.g., new electrode materials, edge rings, focus rings, showerheads).
• Tangible results in boosting tool performance, establishing process parameters, and streamlining process management projects.
• Ability to strictly adhere to safety, quality, and sustainability standards while driving innovative solutions.

Education and Experience

• Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials), Physics, Materials Science, or a related field, or equivalent experience.
• Extensive experience in semiconductor equipment and process management in Dry Etch (LAM Kiyo / Flex / Vantex / Versys, TEL Tactras / RK, AMAT Sym3 / Centura, or equivalent platforms).
• Proven track record in maturing tool performance and establishing plasma process parameters for dry etch equipment.
• Experience in abnormal analysis (FDC, SPC excursions, chamber-matching deviations) and improvement, with a solid history of successful project implementation across DRAM and/or NAND flows.

Job Profile(s):

FAB Engineer 5

Relocation level: (TBD)

Before Getting Started

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