- Location
- Boise, ID,US, US
- Type
- Full-time
- Department
- Engineering
- Experience
- 3+ years
- Education
- PhD
- Source
- Eightfold
Description
Req ID:
JR101850 Engineer - Metals Adv DRAM
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Develop new or modified process formulations, define processing or handling equipment requirements and specifications, and review processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Coordinate design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compile and evaluate test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes. Work directly with process integration and other process areas such as Dry Etch, Wet etch, CVD, Diffusion, Lithography & CMP. Work on state of the art and best in class metals chambers and own the process roadmap to meet program and yield goals. Understand solid-state physics including transition metal oxides, metals, surfaces, and interfaces. Understand fundamental challenges in materials exploration for device scaling. Understand chemical kinetics and their direct application to CVD, ALD, and PVD deposition processes in various deposition reactors.
Employer will accept a Master’s degree in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or related field and 3 years of experience in the job offered or in a related occupation. Alternatively, employer will accept a PhD degree in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or related field. Position requires:
1\. Working with thin film deposition equipment in lab or clean-room environment;
2\. Deposition processes (PVD, CVD or other techniques) and film characterization;
3\. Thin film analysis and surface analysis techniques: SIMS, XPS, EDS, AFM, SEM, or other crystallographic techniques;
4\. Materials physics, including the principles governing the structure, properties and electronic structure of advanced materials;
5\. Material growth mechanisms: thin film deposition, crystallization and interfaces;
6\. Electrical and physical analysis of semiconductor devices or nanostructures, device physics, and principles of electronic circuit design; and
7\. Scientific programming and scripting for data analysis and automation (Python, MATLAB, or JMP).
Job Profile(s):
Semiconductor Process Engineer 3
Relocation Level: TBD
Before Getting Started
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