Director, Package Quality and Reliability

Req. ID:

JR104519 Director, Package Quality and Reliability

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Director, Package Quality & Reliability Engineering

Job Summary

The Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM).

This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC.

Working closely with Package Development Engineering (PDE), front-end fabrication, manufacturing, and quality teams, the role drives Design for Reliability (DFR), qualification rigor, and structured problem-solving at the chip-to-package interface, while building strong team capability and operational excellence.

Main Responsibilities

Package Quality & Reliability Engineering

• Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing
• Identify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo-mechanical stress, and material-related failure mechanisms
• Drive improvements in reliability test coverage and methodologies, aligned to end-use application requirements (e.g., automotive, mobile, data center)
• Ensure robust qualification processes, test plans, and reliability sign-off readiness

Cross-Functional Collaboration

• Partner with Package Development Engineering (PDE) to integrate Design for Reliability (DFR) and Design for Manufacturability (DFM) into package design
• Collaborate with front-end fab teams to address integration challenges across silicon and packaging interfaces
• Work with internal stakeholders and support customer engagements on package quality and reliability topics

Risk Assessment & Disposition

• Provide technical input and recommendations for risk assessment, including new package qualifications, process/material changes, and manufacturing excursions
• Lead or support failure analysis and root cause investigations using structured methodologies (e.g., 8D) for quality issues, qualification failures, and field returns
• Support data-driven evaluation of reliability performance and risk mitigation plans

Leadership & Organization Development

• Lead and develop a team of engineers focused on package reliability, qualification, and failure analysis
• Drive team capability building, training, and adherence to engineering and quality standards
• Establish clear operating rhythms, KPIs, and execution discipline to ensure consistent delivery
• Manage budgets and resource planning, including support for reliability testing infrastructure

Other Responsibilities

• Support alignment across Product Engineering, Manufacturing, and Quality teams to ensure smooth product qualification and ramp
• Drive continuous improvement initiatives in reliability methodologies, failure analysis, and operational processes
• Contribute to strengthening reliability data analytics and digital capabilities
• Provide escalation support on critical reliability and quality issues impacting production or customer commitments
• Support supplier interactions related to package reliability and materials performance
• Leverage AI-enabled tools and data analytics to improve reliability insights, failure analysis efficiency, and decision-making
• Identify opportunities to enhance testing, monitoring, and risk detection using digital and predictive approaches
• Promote responsible adoption of AI to improve engineering productivity and outcomes

Candidate Profile / Job Requirements

Minimum Required Qualifications / Experience

• Bachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or related field (Master’s or Ph.D. preferred)
• 12+ years of experience in semiconductor packaging, reliability, or manufacturing
• 5+ years of experience in people management or technical leadership roles
• Experience in high-volume manufacturing environments with exposure to package quality and reliability

Must Have Technical Skills

• Strong understanding of semiconductor packaging technologies and materials
• Experience in package reliability test methodologies (e.g., temperature cycling, HAST, MSL/preconditioning, board-level reliability) and applicable standards (JEDEC, AEC-Q)
• Working knowledge of failure analysis techniques (e.g., cross-sectioning, SAM, X-ray, SEM/EDX) and root cause analysis
• Understanding of chip-to-package interaction, thermo-mechanical stress, and reliability failure mechanisms
• Familiarity with qualification processes, reliability testing, and risk assessment approaches

Must Have Soft Skills

• Strong leadership and team development capabilities
• Effective collaboration across cross-functional engineering and manufacturing teams
• Structured problem-solving and decision-making skills
• Clear communication skills with the ability to engage both technical and non-technical stakeholders
• Ability to manage priorities and deliver results in a fast-paced environment

Highly Desirable / Preferred

• Demonstrates baseline digital fluency and ability to apply AI-enabled tools for data analysis, problem-solving, and operational improvement
• Uses AI responsibly in line with organizational standards and governance
• Experience with memory products (DRAM, NAND, HBM) in high-volume manufacturing
• Exposure to advanced packaging technologies (e.g., system-in-package, hybrid bonding)
• Experience supporting automotive or AI/HPC reliability requirements
• Familiarity with predictive reliability analytics or digital quality systems
• Experience working with OSATs, suppliers, or external manufacturing partners

Embody Micron’s Core Values

• People – Respect, develop, and empower others
• Innovation – Drive continuous improvement and practical problem-solving
• Tenacity – Demonstrate resilience and accountability
• Collaboration – Build strong partnerships across teams
• Customer Focus – Deliver quality and reliability outcomes that meet customer expectations

Job Profile(s):

Quality Engineering Manager 3

Relocation level: (TBD)

Before Getting Started

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.