Hiring.Camp

: Program Manager – Advanced Packaging (E4)

Applied Materials

·

May 28, 2026

Salary
$134k – $184k
Location
Santa Clara, CA,US, US
Workplace
Remote, Hybrid
Type
Full-time
Department
Management
Seniority
Manager
Experience
5+ years
Education
Bachelor
Source
Eightfold

Description

Key Responsibilities

  • Customer Engagement Leadership
  • Lead end-to-end customer programs, including technical alignment, schedule execution, and resource coordination
  • Serve as the primary interface between IMS, internal business units, and external customers
  • Drive proactive communication and issue resolution to ensure program success
  • Program Execution & Delivery
  • Manage complex, multi-disciplinary programs across global teams
  • Own program timelines, milestones, risk management, and deliverables
  • Ensure alignment across IMS, business units, BD and customer accounts teams
  • Technical Strategy & Expertise
  • Apply in-depth knowledge of advanced packaging inflections including:
  • Logic (2.5D/3D integration, chiplets, hybrid bonding)
  • DRAM (HBM, TSV-based integration)
  • NAND (3D NAND scaling and packaging trends)
  • Translate customer needs into IMS solution strategies
  • Value Articulation
  • Clearly communicate and position IMS value propositions to:
  • Internal Applied Materials business units
  • External customers and partners
  • Support business growth through technical storytelling and solution alignment
  • Cross-Functional Collaboration
  • Work seamlessly with globally distributed teams across engineering, sales, and operations
  • Foster a collaborative, high-performance team environment

Qualifications

Required

  • Education:
  • Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or equivalent
  • Experience:
  • Minimum 5 years of program management experience in a customer-facing role
  • Proven track record of successfully driving technical programs with external customers
  • Technical Expertise:
  • Strong understanding of advanced semiconductor packaging technologies across logic, DRAM, and NAND
  • Skills & Competencies:
  • Excellent communication and presentation skills
  • Ability to clearly articulate complex technical concepts and value propositions
  • Strong organizational and project management skills
  • Demonstrated ability to manage multiple priorities in a dynamic environment
  • Work Style:
  • Self-starter with the ability to work independently with minimal supervision
  • Collaborative team player with strong cross-functional and global coordination skills

## Qualifications

### Education:

Bachelor's Degree (Required)

### Skills

### Certifications:

### Languages:

### Years of Experience:

7 - 10 Years

### Work Experience:

## Additional Information

###

### Shift:

10-Day 8-Hr (United States of America)

###

### Travel:

Yes, 20% of the Time

###

### Relocation Eligible:

Yes

### Referral Payment Plan:

None

U.S. Salary Range:

$133,500.00 - $183,500.00

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

Skills

Risk ManagementProject ManagementProgram Management

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