Data Engineer – Yield Automation (3DIC Platforms)

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Company:

Qualcomm Semiconductor Limited

## Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

General Summary:

We are seeking a Data Engineer to help build and scale the data foundations of the Yield Architecture & Engineering automation function in Taiwan. The goal of this function is step-change efficiency: turning multi-week engineering analysis cycles into days by connecting data sources directly, validating inputs and outputs automatically, and eliminating manual back-and-forth. The engineer will work closely with the automation scaling team to accelerate platform maturity, improve stability, and establish scalable data foundations, ultimately expanding into broader automation initiatives across the team.

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field.

Key Responsibilities:

Data Platform Development

• Design, build, and maintain SQL- and Python-based data pipelines and APIs that deliver wafer-, die-, and bin-level test data to engineering applications on demand.

• Collaborate on data schema design and quality checks to support long-term platform growth.

• Diagnose and improve query and pipeline performance on large production tables through sound indexing, query design, and caching.

• Verify every change with before/after comparisons and regression checks so the platform stays stable as usage grows.

Automation & Data Quality

• Automate input and output quality checks so that data issues are caught before they cause rework or repeated iterations.

• Automate recurring data processing, validation, and reporting tasks to shorten turnaround time.

• Document data flows, design decisions, and known issues to support knowledge sharing and team scaling.

Collaboration

• Work with yield, diagnostics, and design engineers across Taiwan, the US, and India to translate data requirements into practical tools.

• Ramp up quickly on existing platforms, team processes, and 3DIC domain context with mentorship support.

Minimum Qualifications:

• Bachelor’s degree in a related field with 2+ years of relevant experience.

OR

• Master’s degree in Engineering, Computer Science, Information Management, Data Science, or a related field, with 0–2 years of relevant experience;

Preferred Qualifications:

• Exposure to semiconductor manufacturing, yield analysis, quality engineering, or 3DIC-related topics (through coursework, projects, or work experience).

• Experience applying data analytics or statistical methods to identify issues, improve processes, or support decision-making in a technical or manufacturing environment.

• Familiarity with data visualization, frontend data integration, or building data applications.

• Demonstrated ability to learn new domains quickly and contribute to cross-functional automation or scaling initiatives.

• Good communication skills and a collaborative, proactive attitude.

Preferred Skills:

• Demonstrated industry-level data analytics experience, through work or substantial projects, applied to real engineering or manufacturing problems.

• 3DIC knowledge through coursework, projects, or work experience (for example, wafer stacking, hybrid bonding, TSV, stack genealogy, or 3DIC reliability).

• Hands-on SQL (joins, aggregation, indexing; PostgreSQL preferred) and Python (pandas or equivalent).

• Experience building or maintaining a data pipeline, data application, or analytics workflow.

• Strong problem-solving skills and the ability to ramp up quickly in a new technical environment.

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