Senior Member of Technical Staff, Advanced DRAM Overlay Engineer
Micron Technology
·Yesterday
- Location
- Boise, ID,US, US
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Source
- Eightfold
Description
Req ID:
JR109327 Senior Member of Technical Staff, Advanced DRAM Overlay Engineer
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Key Responsibilities
Overlay Strategy, Roadmap & Technical Leadership
- Own the overlay roadmap including bond overlay technologies.
- Serve as the technical authority for overlay, defining overlay specifications, error budgets, mark strategies, technical signoff criteria, and scaling requirements for future technology nodes.
- Develop innovative overlay solutions that enable advanced bonding while meeting performance, yield, manufacturability, and scaling objectives.
- Drive advancement of overlay metrology, automation, process control, modeling, and analytics capabilities in partnership with Process and Metrology teams.
- Apply advanced analytics, Artificial Intelligence, simulation, and experimental methodologies to accelerate learning, identify root causes, and improve overlay performance.
Technology Development & Problem Solving
- Lead simulation and experimental process development activities, balancing modeling with hands-on characterization and technology development.
- Develop and maintain overlay error budgets, validation plans, experiments, and technical assessments that connect process behavior to device and integration requirements.
- Solve complex overlay challenges involving alignment, distortion, deformation, process interactions, and bonded wafers.
- Translate technical findings into actionable process improvements, technology decisions, and roadmap recommendations.
Cross-Functional & Supplier Leadership
- Provide technical leadership across Process Integration, Lithography, Bonding, Metrology, Automation, Process Development, Equipment Development, and Manufacturing organizations.
- Lead and influence supplier engagements supporting lithography, bonding, metrology, automation, and next-generation overlay capabilities.
- Participate in supplier selection, capability development, and HVM tool decisions.
- Communicate technical recommendations, risks, and strategic direction to engineering teams and leadership.
- Mentor engineers and help build overlay expertise across the broader Advanced DRAM organization.
Job Profile(s):
Semiconductor Process Eng MTS - Semiconductor Process Eng SMTS
Relocation Level: TBD
Before Getting Started
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