Sr. Engineer, CMP/Bond Equipment Development

Req ID:

JR113588 Sr. Engineer, CMP/Bond Equipment Development

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Install, start-up, and continually improve cutting edge semiconductor processing equipment and hardware both internally with process engineering and externally with vendors to enable leadership in next-gen memory. Apply project management skills to projects and demonstrate the ability to exchange complex information with customers Set Module Level. Identify alternate CMP/Bond hardware technologies Recognizing opportunities and provide feedback to R&D personnel for technical innovation. Mentor new engineers and other upcoming engineers. Drive module level development and lead large projects of a technical nature. Standardize methods and procedures across area, department and/or FABs. Research, gather and analyze information related to specific assignments within your technical discipline. Recommend process or equipment changes to improve FAB metrics Interpret results and conduct quantitative analyses. Interpret results of new or modified equipment or processes. Design, develop, and implement technical products, systems, or processes to improve product quality and/or Fab performance Evaluating issues and define solutions to develop and implement improvements in equipment or processes to improve scrap, cost, rework, cycle time, throughput or yield. Resolve integration issues through process development. Identify and evaluate interactions between equipment, modules and processes and resolve related issues.

Employer will accept a Bachelor’s degree in Engineering Technology, Electrical Engineering, Materials Engineering or related field and 2 years of experience in the job offered or in related occupation.

Position requires:

• Semiconductor process or equipment engineering experience.
• CMP/Bond (including Grind and Edge Trim) equipment development with fundamental understanding of CMP and Grind process and equipment interactions.
• Designing experiment techniques (DOE), defect analysis, and data analysis.
• Analytical skills, including JMP Pro 18, and EMA and problem-solving skills using model-based problem solving methodology.
• Statistical methods, including SPACE and E3 software.
• CMP and Grinding tools

Job Profile(s):

Equipment Engineer 3

Relocation Level: TBD

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