Principal Infrastructure Researcher – 3D Integration

Job Mission

As Principal Infrastructure Researcher, you are responsible for defining, developing, and realizing the infrastructure required for advanced  hybrid bonding research  focused on the impact on the requirements of future lithography tools.

You will establish the infrastructure roadmap, identify required technology capabilities, coordinate equipment selection and integration, and ensure availability of the experimental environment needed T

Job Description

Define Infrastructure Strategy

• Define the infrastructure roadmap for advanced hybrid bonding research.
• Translate technology requirements into infrastructure investments and equipment specifications.
• Identify future capability gaps and define mitigation plans.

Build and Realize Research Infrastructure

• Lead the realization of bonding research facilities, laboratory capabilities, and demonstrator environments.
• Define requirements for bonding, cleaning, plasma activation, CMP, wafer handling, and associated process equipment.
• Coordinate equipment procurement, installation, qualification, and operational readiness.
• Ensure availability of test vehicles, process flows, and supporting infrastructure required for experimental validation.

Technology and Partner Management

• Select and manage external technology partners and equipment suppliers.
• Establish collaborations with research institutes, universities, and industrial partners.
• Evaluate emerging technologies and identify opportunities to accelerate technology development.
• Drive technical discussions with internal and external stakeholders.

Research Program Leadership

• Contribute to the technical direction of e.g. spatial high frequent field action in both DUV and EUV scanner platforms
• Balance infrastructure investments against program objectives and milestones.
• Communicate progress and recommendations to technical and management stakeholders.

Education and Experience

• PhD in Semiconductor Processing, Physics, Materials Science, Mechanical Engineering, Chemical Engineering, or related field, or MSc with extensive relevant experience.
• Proven experience in semiconductor process development, thin film processing, advanced packaging, wafer bonding, or related technology domains.
• Experience with development and deployment of complex laboratory or manufacturing infrastructure.
• Strong understanding of 3D integration
• Experience working with research institutes, suppliers, and multidisciplinary development teams is highly desirable.

Personal Skills

• Visionary researcher with strong technical and strategic insight.
• Able to create direction in highly ambiguous environments.
• Strong system-thinking and analytical capabilities.
• Excellent stakeholder-management skills.
• Natural technical leader who influences without formal authority.
• Strong communicator towards specialists, architects, and senior management.
• Passionate about translating technology opportunities into impactful research capabilities.
• Comfortable operating in multidisciplinary and international environments.

This position requires access to controlled technology, as defined in the United States Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with candidates who are immediately eligible to access controlled technology.

Inclusion and diversity

ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that inclusion and diversity is a driving force in the success of our company.

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