Senior Quantum 3D Integration and Packaging Engineer

At Applied’s CTO group, we focus on solid-state solutions for quantum technology, i.e. superconducting qubits and optical quantum computing. Our primary objective is to collaborate with system companies and universities to develop quantum devices with significantly lower error rates compared to current standards. Our approach centers on harnessing state of the art materials engineering and semiconductor processing, as well as our expertise in advanced (metasurface-based) optics to enhance device performance.

To achieve this goal, we're seeking a passionate technologist with strong semiconductor and 3D integration background to develop advanced packaging solutions for emerging markets and new technology inflection on quantum information. We value our people and teams who turn possibilities into reality. We are deeply committed to fostering a Culture of Inclusion where every person knows they belong, feels empowered to bring their whole self to work, and is inspired to grow.

Responsibilities

• Create 3D integration and packaging solutions for different platforms and quantum structures

• Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices

• Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines

• Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues

• Generate internal and external documentation for products, presentations and technical reports

• Design and conduct experiment, measure material and device properties and interpret data

• Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies

• Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions

Requirements

• PhD, Master's, or Bachelor's degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.

• 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.

• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, and related packaging technologies.

• Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.

• Experience with DOE, data analysis, process optimization, and root cause analysis.

• Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.

• Strong problem-solving, technical communication, and cross-functional collaboration skills.

• Ability to work effectively with customers, startups, universities, and multidisciplinary R&D teams.

Work Location

• Science Park II (Moving to Tampines office starting May 2027)

## Qualifications

### Education:

Bachelor's Degree

### Skills

### Certifications:

### Languages:

### Years of Experience:

7 - 10 Years

### Work Experience:

## Additional Information

###

### Shift:

Day (Singapore)

###

### Travel:

###

### Relocation Eligible:

No

### Referral Payment Plan:

None

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.