Senior Materials Engineer / Scientist

Req. ID:

JR117298 Senior Materials Engineer / Scientist

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

# Responsibilities will include, but are not limited to:

· Develop, characterize, qualify, and integrate advanced materials supporting next-generation memory and packaging technologies.

· Form hypotheses, design and execute rigorous experiments, analyze data, and translate learning into material and technology decisions.

· Generate new ideas and practical materials solutions that address performance, reliability, manufacturability, scalability, and cost challenges.

· Challenge existing assumptions, specifications, and development practices constructively when data supports a better approach.

· Investigate materials behavior, interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions.

· Work with process, integration, product, manufacturing, quality, equipment, and supplier teams to move materials from concept through qualification and manufacturing readiness.

· Engage suppliers, universities, research organizations, and other external partners to evaluate and accelerate new materials technologies.

· Contribute invention disclosures, patents, technical reports, presentations, and publications where appropriate.

· Demonstrate strong ownership, urgency, resilience, collaboration, and a willingness to work hands-on through difficult technical problems.

· Leverage advanced digital, modeling, simulation, data analytics, and artificial intelligence (AI) tools to accelerate materials development, technical problem solving, and innovation.

# Areas of current interest include, but are not limited to:

· Advanced polymer composites and encapsulation materials, including non-conductive films (NCF), molded underfill (MUF), mold compounds, underfills, and die-attach materials.

· Temporary bonding and release materials, carrier systems, back-grind and dicing tapes, and other materials supporting thin-wafer handling.

· Advanced polymers and dielectrics, films and coatings, adhesion and interface materials, surface preparation materials, electronic materials, thermal materials, and substrate or redistribution-layer materials.

· New and emerging material platforms that can enable future HBM, 3D memory, heterogeneous integration, and advanced packaging technologies.

This list is illustrative, not restrictive. Direct semiconductor or advanced packaging experience is valuable but not required. Candidates from other materials-intensive industries, research institutions, or technology fields are encouraged to apply if they demonstrate strong materials science depth, innovation, technical accomplishment, learning agility, and the ability to translate their experience to new technology challenges.

# Successful candidates for this position will have:

· Strong materials science fundamentals and understanding of structure-property-process-performance relationships.

· Demonstrated capability to solve complex technical problems through experimentation, analysis, and structured problem solving.

· Creativity, curiosity, drive, learning agility, and the ability to work effectively in ambiguous and rapidly evolving environments.

· Ability to communicate technical concepts clearly and collaborate across disciplines, organizations, suppliers, and geographies.

· Evidence of innovation or technical contribution through new material development, improved technology capability, invention disclosures, patents, publications, or other measurable impact.

· Ability to work independently while seeking input, building alignment, and delivering results as part of a global team.

· Demonstrated curiosity and willingness to adopt emerging technologies, including AI-enabled tools, to improve productivity, technical learning, and decision quality.

Job Profile(s):

Product Development Engineer 4 - Product Development Engineer 5

Relocation level: (TBD)

Before Getting Started

Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

• Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

​​​​

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.