MEMS Wafer Fab G5 KKM Process Engineer

MEMS Wafer Fab G5 KKM Process Engineer

Description -

What a G5 KKM Process Engineer Specialist does at HP:

As a G5 KKM Process Engineer Specialist, you will serve as the technical owner and subject matter expert for the G5 KKM workcenter, covering Grinder, Stealth Dicer, and Separator process technologies. You will drive strategic process roadmap development, advanced process capability improvements, manufacturing excellence initiatives, and next-generation technology deployment to support HP's future printhead products and business objectives.

Key Responsibilities

Technology Ownership & Manufacturing Strategy

• Serve as the technical owner for Grinder, Stealth Dicer, and Separator technologies.
• Define process capability roadmap, technology strategy, equipment roadmap, and manufacturing standards.
• Develop long-term plans to improve process capability, productivity, yield, and manufacturing robustness.

Advanced Process Development & NPI Leadership

• Lead development and qualification of next-generation wafer thinning and singulation processes.
• Drive advanced process characterization through DOE, process modeling, statistical analysis, and reliability evaluations.
• Partner with Product Development, R&D, and Process Integration teams to define future manufacturing solutions and technology requirements.

Yield, Reliability & Quality Leadership

• Lead factory-wide initiatives addressing complex yield and reliability challenges related to:
  • Wafer thinning
  • TTV variation
  • Wafer breakage
  • Stealth dicing defects
  • Crack propagation
  • Chipping
  • Die separation integrity
  • Mechanical strength and reliability
• Drive breakthrough improvements in yield, cost, quality, productivity, and manufacturing performance.

Business Continuity & Supplier Development

• Lead Business Continuity Planning initiatives including:
  • Tool redundancy strategy
  • Alternate process qualification
  • Dual source development
  • Risk mitigation planning
• Influence supplier roadmaps for equipment, consumables, laser technologies, and grinding technologies.

Continuous Improvement & Manufacturing Excellence

• Drive factory automation, smart manufacturing, advanced process control, and digitalization initiatives.
• Establish best practices and standardized methodologies across workcenters.
• Lead strategic CIP projects with significant business impact.

Technical Leadership

• Mentor engineers and technicians across the organization.
• Provide technical direction and leadership during major yield excursions and manufacturing challenges.
• Act as the primary technical escalation point for complex KKM-related manufacturing and process issues.

Cross-functional Leadership

• Collaborate with Manufacturing, Process Integration, Product Engineering, Reliability, Quality, Supply Chain, Equipment Engineering, and Worldwide Engineering organizations.
• Lead cross-functional efforts that improve manufacturing capability, product quality, factory capacity, and business continuity.

Individuals who do well in this role at HP usually possess:

• Bachelor or Master degree in Mechanical Engineering, Manufacturing Engineering, Materials Science, Electrical Engineering, Physics, or related discipline.
• Typically 5-10+ years of semiconductor wafer fabrication, MEMS manufacturing, or advanced manufacturing experience.
• Deep expertise in wafer backgrinding, thinning, stealth dicing, laser processing, singulation technologies, or precision manufacturing.
• Strong understanding of advanced DOE, SPC, FMEA, reliability engineering, process characterization, and manufacturing process control.
• Demonstrated track record delivering measurable improvements in yield, quality, productivity, and manufacturing cost.
• Strong technical leadership and project leadership capabilities.
• Excellent communication and influencing skills across local and global teams.
• Ability to manage highly complex technical challenges with significant business impact.
• Self-driven and strategic thinker with strong execution focus.
• Able to work in cleanroom manufacturing environment.
• Able to support overseas collaboration and travel when required.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Singapore)

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"