Hiring.Camp

Principal Engineer / MTS, PDE Package Design

Micron Technology

·

Yesterday

Location
SG
Type
Full-time
Department
Engineering
Seniority
Lead
Experience
10+ years
Education
PhD
Source
Eightfold

Description

Req. ID:

JR114154 Principal Engineer / MTS, PDE Package Design

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities

  • Own package architecture and execution from feasibility through tape-out, qualification, and production readiness, ensuring design intent is translated into manufacturable, reliable, and scalable solutions.
  • Serve as the technical authority for complex package issues, leading cross-functional reviews, trade-off decisions, and risk closure across product, silicon, technology, assembly, quality, supplier, and OSAT teams. Balance performance, reliability, manufacturability, cost, quality, and schedule to deliver production-ready solutions while mentoring engineers through difficult technical decisions.
  • Advance design rules, methodologies, automation workflows, and technology roadmaps for future products.
  • Represent the packaging team in Silicon–package–board co-design by integrating floorplan, interface, interconnect, power, signal, thermal, and mechanical requirements, and resolve cost and manufacturing trade-offs to achieve a balanced package solution.
  • Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcome.

Requirements

  • Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, or a related discipline; PhD candidates are welcome to apply.
  • Minimum 10 years of relevant experience with deep expertise in package architecture and silicon–package co-design, including feasibility, stack-up, I/O and interconnect planning, substrate layout, routing, power delivery, signal return paths, and design verification.
  • Hands-on experience with multiple relevant package technologies and strong knowledge of manufacturability, assembly processes, substrates, materials, reliability, and failure mechanisms.
  • Proven ownership of complex package designs from feasibility and trade-off studies through NPI tape-out, qualification, and manufacturing handoff.
  • Advanced proficiency with Cadence Allegro Package Designer / SiP Layout or equivalent package-design tools, including design-rule and review workflows.
  • Strong technical leadership, mentoring, and stakeholder communication skills, with influence without direct authority; MTS candidates must demonstrate organization-wide impact on roadmaps, standards, or investment decisions.
  • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
  • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work

Job Profile(s):

Semiconductor Design Engineer 5 - Semiconductor Design Eng MTS

Relocation level: (TBD)

Before Getting Started

Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

  • Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
  • If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

​​​​

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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