Product Integration Lead, HIG High Bandwidth Memory

Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD). Collaborate with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging and Global Quality Teams to achieve competitive systems and resolve any gaps between HBM commit and system requirements. Understand sample usage and any gaps in capability to system requirements, managing HBM sample delivery in sync with system development needs and timelines. Assist with risk assessment of identified issues. Lead Triage Team for any System or Chip Feature Interaction requiring clarity of failure ownership domain. Coordinate mitigations with key stakeholders. Manage Qualification Definition and Changes, driving the Change Control Board for Late/Post Qual Changes. Communicate proper priorities within HBM Development team to maintain focus on achieving system specs and address concerns with Component and System teams. Bachelor's Degree or Master's Degree in Electrical or Computer Engineering. 10+ years of demonstrated ability in Product, Design, Yield Enhancement, or related engineering fields. Experience with product development projects is a plus. Proven capability to lead technical issues to closure with creative, effective solutions through a highly collaborative approach. Desire to develop knowledge and expertise in overall HBM to System development. Knowledge of DRAM/HBM device/design and system management is beneficial. Excellent interpersonal, communication and presentation skills to gather technical information from engineering key stakeholders and drive technical issue resolution/mitigation.