SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI

Req. ID:

JR108983 SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As FE CPIE CPI PI Senior Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity.

In addition, you will leverage AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate problem solving, improve productivity, enhance decision quality, and drive continuous innovation across product yield, quality, and business processes.

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

• Drive AI and digital transformation initiatives by leveraging AI-powered tools, data analytics, automation solutions, and intelligent workflows to improve engineering efficiency, accelerate root cause analysis, enhance decision-making, and increase organizational productivity.

Requirements

• Bachelor’s or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field .

• 5 years relevant experience in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.

• 3 years relevant experience on DRAM High Performance Memory(HPM), BEOL integration, advanced packaging and layout.

• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail in Semiconductor Industry.

• Good multi-tasking, verbal, and written communication skills.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good organizational capabilities and ability to work effectively with minimal supervision.

• Intermediate to advanced proficiency in Microsoft Office, AI-enabled productivity tools (e.g., Microsoft Copilot), and digital collaboration platforms.

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.

• Travel Required: Yes. Willing to travel as needed to support department goals

• Travel Frequency: 20-50%.

• Experience or strong aptitude in utilizing AI, data analytics, and digital technologies to enhance engineering decision-making, operational efficiency, and cross-functional collaboration.

Job Profile(s):

FAB Engineer 3

Relocation level: (TBD)

Before Getting Started

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• Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.