PRINCIPAL ENGINEER – FE OCT CPEE HVM DRY ETCH

Req. ID:

JR105383 PRINCIPAL ENGINEER – FE OCT CPEE HVM DRY ETCH (Evergreen)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Fab Engineer at Micron Technology, Inc., you will be working with a team of other process and equipment engineers responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. This position will identify, diagnose and resolve process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities

• Strategize and lead productivity, yield, quality, and cost improvement engagements with global sites and the network team via plasma process optimization, new/FOAK chemistry & hardware qualification, and CIP development collaboration with dry etch suppliers.
• Collaborate with cross-functional teams to drive breakthroughs in defect reduction, particle/residue control, CD uniformity, profile control, and chamber-matching across the global fleet.
• Develop the process and hardware CIP roadmap for Dry Etch — covering chamber parts, RF/match networks, gas delivery, ESC, endpoint, and plasma source upgrades.
• Drive process & hardware improvement with emphasis on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules (Conductor Etch, Dielectric Etch, Poly/Gate Etch, Metal Etch, High-Aspect-Ratio (HARC) Etch, Spacer/ALE, etc.).
• Partner with suppliers to establish equipment start-up acceptance criteria, chamber qualification flows, and tool service requirements; work with global facilities to address new tool installation requirements (abatement, exhaust, RF compliance, gas/chemical infrastructure).
• Improve tool efficiency, WPD, and utilization across all Micron Dry Etch fleets through benchmarking, MAXOUT-style productivity programs, and pathfinding solutions.
• Set up IoT/FDC sensors and advanced chamber telemetry for defense-line strengthening in Dry Etch tools and develop new solutions for excursion prevention and chamber-health monitoring.
• Establish and improve process windows and recipe robustness, upgrade process capability (CD, profile, selectivity, ARDE, LER/LWR control), and reduce production costs (consumable lifetime extension, gas usage optimization).
• Enable new solutions for energy savings (RF power optimization, eco-mode), PFC/F-gas abatement, and waste reduction aligned to Micron's sustainability targets.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Requirements:

• Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials), Physics, Materials Science, or a related field, or equivalent experience.
• Extensive experience in semiconductor equipment and process management in Dry Etch (LAM Kiyo / Flex / Vantex / Versys, TEL Tactras / RK, AMAT Sym3 / Centura, or equivalent platforms).
• Proven track record in maturing tool performance and establishing plasma process parameters for dry etch equipment.
• Experience in abnormal analysis (FDC, SPC excursions, chamber-matching deviations) and improvement, with a solid history of successful project implementation across DRAM and/or NAND flows.
• Proven experience in plasma process and hardware improvement and development within the semiconductor industry, specifically in Dry Etch.
• Remarkable skill in developing and implementing hardware CIP roadmaps and start-up acceptance criteria for dry etch chambers and consumable parts.
• Strong analytical skills for evaluating, promoting, and planning new etch platforms, chemistries, and chamber kits (e.g., new electrode materials, edge rings, focus rings, showerheads).
• Tangible results in boosting tool performance, establishing process parameters, and streamlining process management projects.
• Ability to strictly adhere to safety, quality, and sustainability standards while driving innovative solutions.
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes

Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Job Profile(s):

FAB Engineer 5

Relocation level: (TBD)

Before Getting Started

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• Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.