- Location
- Seremban, Malaysia
- Type
- Full-time
- Seniority
- Senior
- Experience
- 5+ years
- Source
- Workday
Description
About the Role
We are seeking a Senior Process / Equipment Engineer – Molding to develop, sustain, and continuously improve molding processes and equipment in a high-volume semiconductor manufacturing environment. This role plays a key technical leadership position, responsible for process robustness, equipment performance, yield improvement, and technology readiness from development through High Volume Manufacturing (HVM). Experience supporting BIM lines is a strong advantage.
What You Will Do
• Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
• Own molding process performance, yield, and equipment stability in production.
• Provide technical leadership and guidance on molding-related topics within cross functional teams.
• Support New Product Introduction (NPI), process qualification, and smooth ramp up into HVM.
• Drive continuous improvement initiatives to improve yield, quality, reliability, UPH, and cost efficiency.
• Identify molding process integration risks and define mitigation plans using
structured engineering methods.
• Troubleshoot and resolve molding-related issues involving compound behavior, tooling, equipment, and system interactions.
• Collaborate closely with Process, Equipment, QA, R&D, NPI, Product Design, and Reliability teams.
• Support molding compound selection, evaluation, and change management to
ensure stable manufacturability.
• Maintain and update technical documentation such as SOPs, process
specifications, control plans, FMEAs, and technical reports.
• Contribute to technology and package roadmaps through benchmarking, studies, and data-driven recommendations.
• Provide technical support to internal stakeholders and external customers when required.
• Perform effectively in a fast-paced, high-volume manufacturing environment.
What You Will Need
• Bachelor’s degree in Engineering or a related technical discipline.
• Minimum 5 years of semiconductor manufacturing experience, with strong focus on molding processes and equipment.
• Strong understanding of backend assembly molding processes, including
compound flow, curing behavior, and defect mechanisms.
• Hands-on experience with molding tooling; experience with Lauffer molding
systems is a strong advantage.
• BIM line experience is a plus.
• Knowledge of molding compound properties, interactions, and material behavior.
• Familiarity with Six Sigma, DOE, SPC, FMEA, 8D, and statistical analysis tools.
• PLC knowledge or system-level understanding is a significant advantage.
• Strong analytical, troubleshooting, and structured problem-solving skills.
• Excellent communication and interpersonal skills with good command of English.
• Ability to work effectively across functions and influence without authority.
• Self-motivated, proactive, customer-focused, with a strong ownership mindset.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
